2010 54 LED wafer fab in the construction of the class accounted for most of the 50% in China

International semiconductor equipment and Materials Industry Association (SEMI) predicted that in 2010 the global foundry process equipment expenditure scale, compared with 2009 growth of 133%, and again in 2011 18% growth rate. While the global wafer fab capacity has been established, including discrete component plants, is estimated to grow by 7% in 2010, and in 2011 will grow by more than 8%.

The World Fab Forecast report is expected, in 2010 the global wafer plant construction spending will grow by 125% in 2011 will grow by more than 22%. According to SEMI, in 2010 and 2011, there will be more than 150 Fab construction plans for spending an estimated $83 billion; the estimate is based on the Fab construction plan and equipment spending plans made, tracking object covers a large / small capacity fab, and the production of micro electromechanical system (MEMS), Fab LED, discrete components.

The report notes that in 2010 there were a total of 54 wafer fab projects under construction, with a total spending of around $4 billion 500 million; of these, was a LED wafer fab, and most of them were in china. In 2011 the implementation of the wafer plant construction plan, although less, but the scale is relatively large, the total expenditure of about $5 billion 500 million construction.

SEMI estimates that in 2010 global semiconductor equipment spending will grow by 133% to $34 billion, while in 2008, global semiconductor equipment spending is growing by 27%. The association also predicted that in 2011 the global semiconductor equipment spending will grow 18%, reaching $39 billion, beyond the level of 2007.

As for the number of Fabs operating in 2010, about 22, of which more than five of Chengdu's LED plant, and next year, is expected to have a total of about 28 wafer plants, including a total of 4 memory plants. By the end of 2010, the world has for wafer capacity (excluding discrete components), is estimated to reach 14 million 400 thousand per month 8 inch equivalent wafer, in 2010 the figure is expected to grow 8% to 15 million 800 thousand and 8 inch wafer equivalents per month.

SEMI pointed out that the memory factory is to occupy the global has built the largest wafer production capacity, the proportion is about 41% in 2010 and 2011; foundry is the second, occupied proportion by 24% in 2009, growth in 2011 to about 26%.