Across the board to overcome the high-power LED lighting cooling

With LED lighting increasingly urgent demand, heat dissipation of high power LED has received increasing attention, because the high temperature will cause the LED luminous efficiency attenuation; waste heat generated by the LED operation if it can not be effectively dissipated, it will directly affect the life of LED, fatal so in recent years to solve the problem of high power the LED radiation problem has become many R & D related industry standard.

For cooling technology for high power LED, each company is Gexianshentong, such as Taiwan gwanghaegun technology developed'COHS package cooling technology ', light technology is the use of the sea itself board design capacity advantage, directly to the LED package in the copper base high thermal conductivity, high thermal conductivity of copper just as the radiator role, coupled with the circuit design and its process to overcome the insulation film and the adhesion between the copper material quality problem, developed the so-called COHS Technology (ChipsOnHeatSink), and has 47 COHS related patents.

COHS cooling technology prospects can be expected

Gwanghaegun technology said that the company's'COHS cooling technology "is different from the traditional COB package, eliminating the chip and the base of unnecessary resistance materials, and the thermal conductivity is better than aluminum copper as the substrate, and the wick module over 60W, adding the concept of uniform temperature plate the heat conduction can more quickly from. On the whole, the advantages of this technology include the low thermal resistance of the module, the easy control of the junction temperature, the test points which can be used to measure the junction temperature, the structure with low cost, simple installation, good heat dissipation and so on. At present, the products have been applied to the LED street lamp project in Qingyun County of Shandong Province, the engineering of LED street lamp in Beijing city and all kinds of indoor and outdoor lighting.

Held in South Korea Industrial Technology University in Japan before the new product test, gwanghaegun technology 120 Watt (W) electrode module temperature is about 70 degrees Celsius, the electrode temperature of other companies 60 watt level model is as high as 150 degrees Celsius, less than half of the power light seafood, electrode temperature but much higher, which shows the advantages of light sea cooling technology. It is understood that in order to enter the Korean market, gwanghaegun technology will invest 10 million dollars in the construction of the production line of Gyeonggi Do South korea.

COHS cooling technology is the use of a copper substrate, is another popular attention of the cooling technology is the use of ceramic substrate, ceramic substrate by cost competitive, and has a close thermal expansion coefficient and high heat resistance and semiconductor, can effectively solve the problem of high temperature and heat deflection process problems, therefore. At this stage, many companies have invested in research and development of ceramic substrate technology, such as tai-saw.

Radiating ceramic substrate

Tai-saw general manager Liu Huanlin said that the LED ceramic plate will be the main growth momentum tai-saw future. The company's products for DPC ceramic substrate. Type of ceramic substrate is common at this stage there are HTCC, LTCC, DBC, DPC four, among them, DPC (DirectPlateCopper) is the ceramic substrate by vacuum sputtering plating on the copper layer, and manufacturing line with development process, the process of combining technology and materials for thin film ceramic substrates, the most commonly used in recent years the.

Basically, LED substrate is divided into metal and ceramic substrate.

Metal substrate with aluminum or copper as the material, because the technology is mature, and cost advantages, the products used for general LED. The ceramic substrate line alignment accuracy, thermal conductivity and heat dissipation performance recognized as excellent material for the industry, is currently the heat dissipation of high power LED optimum scheme, although the cost is higher than the metal substrate, but the heat and stability of the lighting requirements higher than notebook computer, TV and other electronic products, therefore, including Cree, OSRAM, PHILPS and arias other international companies, are used as ceramic substrate LED grain cooling material.

Comparison of various ceramic cooling technology, the HTCC (high temperature co fired multilayer ceramic substrate) is a technique for early development, but due to its high temperature (1300 to 1600 DEG C), the choice of the limited electrode material, and the production cost is very expensive, now gradually replaced by LTCC. In addition, DPC ceramic substrate conduction is better than the low temperature co fired ceramic (LTCC) substrate and the radiating aluminum, so the cooling technology of ceramic DPC popular in recent years, optimistic, Tongxin electronics said the company is currently the ceramic substrate is still in short supply capacity, the factory can produce 300 thousand pieces (4 inch x 4 inch per piece a number of 440 to 890 (depending on Design), Philippines plant monthly production capacity of 100 thousand, there will be 50 thousand new capacity recently added, as a whole, because the LED to replace the traditional lighting for the future trend, therefore tai-saw will benefit from the long-term since application.

Passive component industry in Homeopathy

The application of promising ceramic substrate in LED heat dissipation, Dayi in addition to the manufacture of passive components and protection components, in 2010 further into the LED substrate manufacturing market; high power LED heat dissipation substrate, the company is currently using the existing professional protection component photolithography and electroforming process of thin film, laser cutting device and punctured by the company's own research and development, introduction of alumina and aluminum nitride as substrate material into the production process to begin mass production, which can meet the cooling demand of LED product design and packaging.