3D sensing module manufacturing high complexity, high technology integration manufacturers

3D face sensing technology in Apple iPhone by X, suddenly became popular in the market, should be among the relevant manufacturers in the chain, has become the capital market and pursued the new favorites. In fact, the 3D sensing technology in science and technology has accumulated considerable technology, then we can through the components, modules and subsystems, and the operation and application of terminal system, four aspects of 3D sensing technology brings change.

The first is the component part, from mobile phone unlocking and payment information security needs, mobile phone application from digital password, pattern recognition etc. through the formation of native mobile phone security authentication. From the demand for components, the main function of fingerprint recognition for capacitive sensor, iris recognition is equipped with basic LED IR and IR Camera, and 3D face recognition (if the mining structure light) development, is the need to include the IR Laser, Diffractive Optical Elements, IR Camera and other basic equipment.

Then from the module and system perspective, compared with the traditional fingerprint identification involves the level of IC factory's role, the difference lies in the chip package, need to add Coating technology, designed and manufactured or commissioned a professional module factory making this part of the IC factory; in contrast, iris recognition technology development and structure of light, and hardware design manufacturing involved complexity is much higher than fingerprint identification technology, TX (Guang Yuan) and RX (camera - IR Camera) two independent modules to form a sub system. In addition to the traditional light source and IR Camera from different manufacturers, look at the TX module, not only need chip package technology, integration involves many optical wafer level packaging technology and optical components.

The above paragraph that 3D face sensing if using structured light technology, modules and subsystems related to the complex and domain knowledge, has non traditional supplier and IC. It also shows that if a single vendor wants to finish the system, need the investment of R & D and production scale will be large, in addition to the technical barriers, the market risk is non traditional components factory can bear.

In addition, in addition to the 3D sensing module, algorithm breakthrough, also contributed to one of the key iPhone X 3D advent of face recognition. Compared with the imaging algorithm of fingerprint identification and iris recognition, face recognition 3D to achieve self adaptability, through Neuro Network Engine, in order to complete the recognition of face recognition in the instruction cycle and reasonable energy consumption, which is why Apple until 2017 to launch this product.

However, the system still has several key factors need to be discussed. First, with the Computer Vision perspective, 3D module and subsystem to output can accelerate the computing chip processing information, it will affect the selection and design of the DOEs module and camera module. Second, precision assembly, system control module of 3D data accuracy of thermal expansion and contraction of the material specification, but also limited by the algorithm and the terminal application, or a combination of technologies such as TOF as the reference distance. The complexity of these two modules pulled open the case, it is difficult to have a single application module suitable for a wide range of design.

In addition, from the perspective of the system, the 3D sensing module is used to unlock, but also consider the energy consumption at low power consumption design, how to determine whether there is a face to wait for the unlock, must through the existing IR Camera, or to RGB through Camera, which also makes sense of 3D module design and measurement subsystem appeared different changes.

Finally return to the terminal and application of the most basic, 3D sensing module in the game machine, personal computer (Windows or Hello RealSense), the mobile phone industry, there are commercial lens case, but far less than the Apple with the trend, mainly because of the number of sales of about 200 million iPhone years, even though only one model is equipped with more than 70 million year may also contribute to the carrying.

Because it is Apple, there is enough to support the development scale of output value, gross margin and cooperate with suppliers. However, the 3D sensing module is equipped with iPhone to become the standard, but also depends on whether X is good enough to bring the application situation of Android mobile phone manufacturers are willing to follow up. Furthermore, in the Android mobile phone supply chain operated independently of the 3D sensor, the development of value chain and supply chain are still looking for a mobile phone factory, the main chip industry, spare parts factory, factory to angle module, the future by which vendors take risks, leading products in order to obtain benefits, obviously only in understanding the Android ecosystem, have the opportunity to cross the gap, accelerate the large-scale popularization of 3D face technology.

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