3D sensing technology, firm dynamics and technology development you should know

Although 2018 has just begun, but in September 2017 Apple launched iPhone X, 3D new technology test has become the most discussed topic this year. When it comes to the 3D sensor, most consumers have the impression is probably face unlock, Animoji face detection function two. With the other mobile phone manufacturers are also expected to follow up, after the camp will see non Apple mobile phone equipped with 3D sensor technology, dramexchange LED Consulting Research Center (LEDinside) estimates that the global mobile 3D sensor market will rise to $1 billion 500 million in 2020, a compound annual growth rate of 209%.

In addition to mobile devices, 3D sensing technology can be seen in many other applications, including virtual reality / amplification device, vehicle field, UAV, biological identification, robot, game equipment, notebook computer and home equipment etc.. This also means that there are many vendors in 3D sensing module, component, system or algorithm research. The author lists the major manufacturers of research in the field of its dynamic development, including our familiar technology manufacturers and some manufacturers are also worthy of attention for many years.

The 3D sensor consists of several techniques: when flying distance, structured light, Coding and Stereo Light Vision, the top two most manufacturers to develop.

Microsoft, Sony and other manufacturers have already put TOF flight distance measuring sensor technology development

TOF is mainly through the light in the lens module and the detected object speed to pass back and forth between the calculated and measured by the distance between objects, and module of the system is the key components in play contains pulses of light LED or laser diode and sensing component. After years of development, the TOF sensing technology is gradually mature, the main R & D investment manufacturers have Microsoft, Sony, Infineon, PMD, Technologies.

From the manufacturers put TOF technology research and development history, the outside of the Microsoft to 3D the first impression measuring technology research and development can be traced back in 2009 Microsoft bought 3DV for $35 million Systems, and the 2010 acquisition of 3D dynamic sensing chip factory Canesta. Xbox One then launched the game equipment Kinect is equipped with a TOF sensor technology, let the game player to the game using voice commands or gesture recognition.

Another maker Sony, is bought in 2015 the Belgian gesture recognition technology company SoftKinetic and its most famous DepthSense TOF sensing system. Two years later, Sony will launch the world's smallest TOF sensing component, only 10 micron pixel spacing, but can perform very precise distance measurement.

At the same time, the development of semiconductor manufacturers Infineon and PMD Technologies in Germany also put 3D TOF sensing components, used in many applications, more cooperation in the development of REAL3 Zenfone AR in ASUS TOF image sensing module, the 3D module contains Google Tango and Lenovo Phab 2 Pro, is developed by using PMD module.

In July 2017, PMD also announced a partnership with Chinese startup Untouch, using 3D gesture recognition scheme, who developed the Riemann platform as CamBoard Pico module of FlexX middleware, can let people experience more intuitive human-computer interaction in the use of mobile devices in the process.

In addition, TI also for robots, automation construction and other fields to develop a series of TOF sensing technology.

In fact, a general view, because the sensing principle factors and distance calculation methods, TOF sensor technology many times is often used in the application of focus distance or object detecting, provide measurement data for its distance.

Structure of optical sensing technology dominated by apple supply chain manufacturers

A structure for optical sensing module includes a transmitter and a receiver, through to the detected object with a light, light reflected from object deformation, and then through the algorithm to calculate the depth of the object. Among them, the role of VCSEL is to enhance the light concentration and ensure the light through the optical lens and wafer level diffraction components can be evenly distributed in the body.

In contrast, in the case of the product on the market structure of optical sensing principle for estimation method (estimation of object depth), commonly used in the identification / recognition in the application. On the basis of different algorithms, one can distinguish the characteristics of a person or thing whether the data is consistent with the system in pre and confirm whether the need to unlock the application device, which is the face ID iPhone X, so that we can re-examine the apple 3D sensing module of supply chain.

Integrated apple TrueDepth transmitter module dot in projector, flood illuminator, proximity sensor represents the advanced optical semiconductor technology. VCSEL part of the combination of Lumentum and II-VI design, IQE technology, Winsemi crystal cutting and AWSC packaging technology, and DOE component plastic structure light is provided by the Corning material, TSMC remanufacturing is completed by caijue and fine material process.

The receiver module is the use of Apple's original 7 million pixel camera and Largan, STM, Tongxin electric relay manufacturing infrared lens.

Apple also announced a while ago to Finisar orders, $390 million to buy VCSEL in wireless headset Airpods, Finisar is expected to start shipping in the second half of 2018.

A Qualcomm Himax will be in late 2018 to observe the focus

In addition, this year there will be another 3D sensor supply chain surfaced, members include: Qualcomm, Himax, and VCSEL Lumentum or AMS collocation potential supplier's Princeton will be equipped with Himax, can look forward to the research and development of WLO, DOE components and their operational Qualcomm chip and 3D sensing algorithm module listing. As for the source of the current VCSEL is that with the production of 6 inch wafer capacity of Princeton or Lumentum, either the. The 3D module Qualcomm and Himax camps may be the fastest in the second half of the launch of the Android mobile phone can be seen.

3D sensing technology needs complicated, such as algorithm, chip, optical components must meet high standards, you can imagine how much the number behind this investment firm, the next few years will be more and more involved in the class will be more and more diversified firms.

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