A new technology for the fabrication of low cost printed substrate LED

SIIX, a Japanese electronics manufacturer EMS, has developed a new technology that can put LED on the printed board to realize low cost assembly. By using the original method, the heat resistant LED can be cooled at the same time on the processed printed substrate, and the soldering work can be carried out under the heat of the substrate. LED is considered to be the next generation of lighting technology with low power consumption, but because of the high cost of its popularity bottleneck, the development of new technologies to help popularize the progress.

The new technology in the construction of heat resistant electronic parts, the use of the printed substrate for the general Glass Epoxy resin "FR-4" substrate. The largest diameter 8mm hole is dug on the substrate, and then buried in copper Pin, which is placed on the LED. Heated by the Pin below to conduct the heat conduction solder. Because the melting point of the solder without lead is heated to 230 DEG C, the temperature of the surface of the LED component can only stay at about 70 DEG C, and the temperature is not too high.

Up to now, on the base of Glass Epoxy resin, the LED has been evaluated, and the method of embedding the hole with cheap resin has been evaluated. However, it is difficult to make the heat transfer easy because of the gap. SIIX was then modified to impose copper Pin to increase its strength, and the substrate was buried with copper Pin and worked hard to keep it free from cracks. In order to make the solder melt, the new technology is to transform the "Reflow furnace" from top to bottom, which can be used for cooling. LED and solder can be bonded at the same time on the substrate, and can be completed in a few seconds.

In the past, when the LED is installed on the substrate, most of the soldering machines which are not easy to generate laser light are used, and a LED component is arranged on the substrate by laser, which takes more than one second. In order to make LED easy to heat on the substrate, but also the use of aluminum substrate. If you use the new technology, you do not need to use the high price of the laser soldering machine and aluminum substrate, and can improve production efficiency, but also significantly reduce production costs. OSRAM, the world's largest lighting manufacturer, has also decided to adopt new technologies, and SIIX is actively promoting the technology to other lighting manufacturers. SIIX is a large manufacturer of Japanese EMS, December 2008 revenue is expected to look at 150 billion yen, but also hope to promote the use of new technologies, across the LED industry.