Agilent Technologies launched the industry's thinnest top emitting tricolor LED

Thickness of only 0.35 mm, providing a backlight for the multi function ultra-thin phone and PDA

Agilent Technologies Inc. announced before the launch of the industry at the top of the thinnest light color surface mount LED (light-emitting diode) backlight, and the indicator lamp is mainly used in multi-functional ultra-thin mobile phone and PDA. The launch of the new top of the light-emitting LED and Agilent's recent launch of the side of the light-emitting LED combination, so that the phone and the PDA designer any combination of red, green and blue light source.

In mobile phones and other handheld devices, you can use different colors to display the received SMS (short message system) messages, e-mail and stock quotes. They can even identify different callers. The choice of free lighting color, for office equipment, industrial equipment, as well as household appliances backlight and state indicator, and many other applications to provide a new design flexibility.

Agilent semiconductor products division Chinese and general manager of Hongkong, Mr. Li Ting said, "at the top of our new thickness is only 0.35 mm light color LED is the first of its kind in such a small package in a collection of red, green and blue chip products, it achieved the next generation of ultra-thin portable the product has a variety of colors options. As LED's leading manufacturers, we are committed to providing the most abundant quality products to meet the needs of our customers a large number of lighting and backlight applications."

The Agilent HSMF-C114 tricolor chip type LED uses four terminal common anode connection, fixed in the Agilent mm (long) x 1.5 mm (wide) x mm (high) micro package. Precision manufacturing technology to ensure that the automation of the perfect equipment to pick up equipment.

HSMF-C114 InGaN (indium gallium nitride) blue (main wavelength of 470 nm, the typical brightness value of 20 mA for 70 MCD), green InGaN (main wavelength of 525 nm, the typical brightness value is 180 MCD) and AlInGaP (aluminum indium gallium phosphide) red (626 nm, 85 MCD) wafer together. The LED has scattered light, using the same reflow soldering technology as IR (infrared), and has been certified by lead-free. Agilent ChipLED packaging technology has excellent heat dissipation ability to achieve maximum reliability.

The ChipLED device uses a standard package in accordance with the EIA481 specification: 8 mm carrier tape, a diameter of 7 inches of the reel, placed in a moisture-proof bag.