Annwa launched ultra-thin lead frame package ChipLED products

Avago Technologies (Annwa Tech), announced before, launched by the minimum industry standard package, the thin type light emitting diode chip industry ChipLED products, has long 1.65mm ultra small size 0.8mm * width * high 0.45mm, Avago's new ASMT-Rx45 series low power high brightness ChipLED leadframe package especially for automotive electronics, electronic design mark and industrial applications under harsh conditions.

Avago AllnGap ChipLED ultra-thin ASMT-Rx45 product to develop industry standards based on the ChipLED 0603 platform, in addition to occupy smaller board space, compared to the industry standard PLCC package LED products, but also for designers to save 20 to 30% of the cost, in addition, these ChipLED products also provides a wide viewing angle of 130 degrees, can improve readability. Bright sun. Provide red, tangerine, orange and yellow to yellow green and other colors to choose, ASMT-Rx45 series is suitable for the development of the car dashboard and entertainment terminal backlight applications, and industrial switches and push button backlight and display device with small interior designer.

In addition to high brightness and compact size, Avago ASMT-Rx45 ChipLED also has two important advantages of production environment, first of all, they can adopt the traditional surface mount technology simple welding, the production cost will be reduced to a minimum, in addition the package through JEDEC moisture sensitivity level 2A certification, for manufacturers, this represents the hierarchy these ChipLED products can leave the sealed package placed in the open space (30 C and 60% relative humidity) reached around without moisture absorption in the removal of pre production.

Functional characteristics

Industry standard industry ChipLED 0603 platform

130 degree wide perspective

High brightness output

Can directly replace Stanley 111x and 1114 series products

Humidity sensitivity level 2A

Meet the requirements of automotive lighting applications

The special lead frame structure provides good heat dissipation effect of the ChipLED chip, and can work in the range of -40 DEG C to +100 DEG C temperature

Package size: 1.6mm * 0.8mm * 0.45mm * width

Pb-Free environmentally friendly lead-free packaging and meet the RoHS standard requirements

Source: International Electronic Business