Blu ray flip PK CSP, who is the future of COB technology?

[LED] - after several years of price after the fight, COB dress market tends to rational gradually, but the price war is the law of the market, and now the price of the dress COB space has been very limited.

In order to compete for more market share, while passing on the cost pressures and keep up with the future market, many COB packaging manufacturers have layout flip, at the same time, there are different kinds of flip chip COB technology.

Currently on the market mainstream flip COB technology has two kinds: one is the first spray of fluorescent powder, a white, and then on to the CSP flip chip technology on the substrate; the second is to put blue chips, and then sprayed with fluorescent powder blue chip combination COB flip.

For those two COB technology, who is better? LED interviewed 9 big coffee industry, to talk about the future of these two technologies.

Upside down Blu ray temporarily lead the final or will go a different route

At present, the flip chip combination of blue chip and the CSP chip is not the same as the maturity of the combination, which is superior or inferior". The vice president Dr. Mo Qingwei believes that in the future for a long period of time, the blue chips will be the mainstream flip.

In fact, for the two kinds of technology, ultimately to CSP and flip chip or Blu ray. On the development of these two kinds of chip technology, flip chip blue chip to develop a few years earlier than CSP. At present, the flip chip technology has gradually matured, many companies have launched a product.

But CSP although there are products, but is still in a preliminary stage. So Dr. Mo Qingwei believes Blu ray flip chip COB in the future for a long time is also the mainstream of the current status of these two technologies fit.

Of course, the development of any product or technology is linked to the market, so there is no absolute thing. As Dr. lextar Electronics Marketing Business Group Deputy General Manager Lu Jinyu believes that.

Flip COB due to a flip chip package structure of each attribute, connected to the COB substrate are also different, its specifications and production advantages will be different, but the technical advantages and the present stage can improve the project to be overcome.

But to combine with the market, although the two have lextar electronics manufacturing process of production capacity, but how to determine the appropriate application of COB technology, is standing in the design and production of products to meet customer perspective development plan.

So it is not easy to say what kind of technology is better, more depends on customer demand. Of course, the technology itself to adapt to customer needs, but also to see whether this technology can do better. In this regard, senior vice president, said Wen Jianhua, senior vice president of Asia, these two technologies are completely different application market.

Because the surface light source composed of CSP LED has obvious disadvantages in the light distribution, the uniformity of the light spot and the consistency of the color are difficult to be compared with the flip chip blue chip, and the flexibility of the CSP is relatively low.

But with the development of technology, the cost advantage of CSP will gradually come out. Therefore, the CSP COB will be more customized as a CSP plant for the customer module, used in the field of general lighting.

In this regard, Xia Xuesong, general manager of silicon lighting can agree with the view that the flip blue and CSP flip should be distinguished from the application of the product and process requirements, both have their own advantages.

CSP flip is good, but the threshold is more

This is the current situation, but does not mean that the CSP technology gap is very large. In fact, from the point of view of the development of LED, the maturity of the new technology is getting shorter and shorter, and the new technology has the advantage of the previous generation technology can not do.

In this regard, Zheng Haibin, deputy general manager and marketing director of Jiangxi Chi Chi said on the CSP chip combination will be more in the form of modular modules, in the application of relatively flexible, can be widely used in LED products.

Flip COB products are mainly used in tube lighting part relatively common, some cross in the LED market, the CSP module in the part of application is relatively slight advantage, but a lot of popularity but also the future of CSP flip chip module and COB price.

CSP does have its advantages, but there are also some problems. This honglitronic Relinin said, "the CSP combination of COB process is extremely simplified, the production efficiency is high, but the color consistency is poor; and the flip chip combination blue light color consistency is good, technology is relatively mature, easy to achieve".

Also, as vice president of sales in China Luminus room Ning think. These two kinds of combination, from the cost, the CSP chip can be a large number of standardized production and flexible combination, applicability than the flip chip COB Blu ray high, but there are small differences in CSP each single point color consistency, resulting in two times through the optical effect is poor;

The flip chip blue chip COB principle and optical design is consistent with the formal COB, you can maximize the use of existing optical components and get the same as the current COB.

In addition to the color consistency, Shengpu photoelectric deputy general manager Yin Hui also added that although the two forms of technology is a development trend of LED packaging, but the equipment investment is relatively large, especially in the more complete CSP chip factory, so small packaging enterprises in the investment will be more cautious. These two products are very promising products, but the market acceptance and application also need time to digest.

At the same time, there is also a new moon, general manager of Shenzhen, said Zou Yiming, than flip