CISCO has developed a high yield chip technology for LED sapphire substrate

Japan di CISCO (Disco) developed for the LED sapphire substrate chip processing technology. The characteristics of this technology is that the quality and yield of LED can be considered at the same time. The company called it the sapphire substrate Stealth Dicing Process".

The method of cutting the sapphire substrate with diamond scribing device depends on the technical level of the operator. Therefore, the use of laser cutting sapphire substrate has become the main method, the company had also launched a laser scribing (Laser Scribing) device. Laser scribing, can be fully automatic high-speed processing, improve the yield.

However, compared with the method of diamond scribing, there is a problem of low LED brightness in laser scribing. Therefore, by using the Hamamatsu Photonics (Hamamatsu Photonics) laser chip technology "Stealth Dicing", to solve the problem. Therefore, under the condition of not reducing the yield, the brightness of the LED is controlled. Can also cut the thickness of more than 100 m epitaxial film.

Working mechanism of Stealth Dicing