CREE released 6 inch diameter SiC backplane

America CREE (Cree) released a 6 inch diameter (150mm) of the SiC (bottom English release information). Mainly used in LED, high frequency components and power semiconductor components. According to CREE, the company's SiC floor diameter to 4 inches (100mm) - based, if the use of a 6 inch floor, then the production efficiency will be improved, help reduce the cost of components.

It is understood that after the 6 inch floor mass production, the popularity of SiC power components will accelerate. This is due to increased production efficiency, help to reduce manufacturing costs, the price of SiC power components is expected to reduce. Currently, some manufacturers are being put into operation using 4 inches of SiC diode substrate manufacturing. With the popularity of 6 inches of base plate, is estimated to engage in SiC power components business will increase.

In addition, CREE said that 6 inches of product microtubules (a kind of crystal defects) density of not more than 10 /cm2.