Check and acceptance of Hebei related projects with big heat on flip chip

Recently, entrusted by the Department of international cooperation of the Ministry of science and technology, the Hebei provincial science and Technology Department organized experts to accept the joint research and development of "LED flip chip adhesive technology technology" undertaken by Hebei Da Qi Photoelectric Technology Co., Ltd. Through the examination of the technical data of the project, the field view, the question of the defense and other procedures, the project has been highly appraised by the technical experts at home and abroad and passed the acceptance smoothly.

Through the cooperation with the Japanese bridge production, the international scientific and technological cooperation project has studied the key technologies, such as the new technology of LED chip inversion, the high performance heat dissipation substrate and the preparation of anisotropic conductive adhesive, and developed a new adhesive technology for the LED flip chip, and the COB light source of the adhesive packaging technology of the LED flip chip is more than the formal installation. Packaging COB light source under the same area to accommodate more than 30% of the chip, the total light flux increased by more than 50%; the thermal conductivity of the developed special substrate reached 386 W/m.K, greatly improved the heat dissipation performance; apply for the invention patent 1, and obtain the utility model patent 3 items. Through international scientific and technological cooperation, a number of technical problems, such as LED flip chip adhesive, have been tackled, and a stable and effective cooperative mechanism has been established, and a stable R & D team has been formed in the enterprise.

The project has effectively solved the technical problems such as poor thermal conductivity, poor conductivity, low light efficiency, poor reliability and small number of chips in unit area of LED packaging technology. After the LED flip chip stickiness process is mature, a new technical route will be formed in the field of LED packaging. It is a major technological breakthrough and fills the blank of the adhesive technology of domestic LED flip chip. The application of this technology will replace the positive bonding process on a large scale, and the upgrading of LED packaging technology will be realized.

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