Companies have invested CSP white LED R & D, patent layout which strong?

In recent years, white LED packaging technology solutions, has formed a SMD package based, other packaging mode supplemented by the pattern. For the future direction of the development of white LED packaging, the industry has also carried out a wide range of discussions, including CSP (Chip-Scale-Package) is one of the development direction of concern. About CSP white LED, the industry also has a lot of different titles, such as non packaged LED, wafer level packaging LED, etc..

Continuous miniaturization is an inevitable development path that has been confirmed in the field of electronic device packaging. From this point of view, CSP should indeed be the future of LED packaging. Therefore, the domestic and foreign chip factories, packaging plants have invested CSP white LED R & D, it is reasonable.

We strive to do a good job in the product, the patent should pay special attention to. After all, LED industry, patent pit is still deep.

Because the CSP white LED, white is still the traditional realization method based on the chip + fluorescent powder, so the LED industry chip patents, patents, chip + Phosphor phosphor combination patent inherent patent threshold is still valid for CSP.

CSP white LED characteristics:

Flip chip;

Without the support, the chip pad is directly used as the electrode of the package;

A phosphor layer is coated on the surface to be luminous.

From these three characteristics, the first two chips are part of the thing, CSP (Chip-Scale-Package) can play in fact only in the area of the third: to the surface of the light-emitting layer coated with phosphor".

To sum up CSP related patents, the efforts to "light the surface coated with a phosphor layer" include:

Coated into what shape, is conducive to light efficiency, light and color coordinates;

The structure of the coating (five bread covered, there is only the top of the bread, there is the first chip and then on the transparent layer, there is a transparent layer on the first fluorescent powder);

Process realization.

How to improve reliability.

Cooledge Lighting and Tischler MichaelA. combination, is the CSP white LED field, the strongest patent layout. They apply for a patent that covers all of the above.

In particular, the industry has been criticized for the failure of the stress caused by the problem (as shown below), they have in-depth study, and applied for a number of patents.

Here are a couple of combinations:

Cooledge Lighting is a lighting company in Canada, the main products for the advertising light box flexible FPC surface light source. In the field of CSP has applied for 35 invention patents.

Tischler MichaelA. both as an employee of Cooledge Lighting applications, but also to apply for personal identity. In the field of CSP in the name of individuals to apply for 16 invention patents.

Their invention patent layout in the world, including the United States patent, European patent, Chinese patent, Japanese patent, Korean patent.