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Experts R & D can be used for the development of CSP thin film coating patented technology

Headquartered in Hongkong, the company has a wholly-owned subsidiary of Silicon Valley, Taiwan, Hsinchu, mainland China and Zhejiang. Experts successfully developed the most advanced photoelectric film coating patent technology will be used in the semiconductor process spirit into white LED fluorescent powder coating, can supply fluorescent powder film (Phosphor Film) and CSP flip chip products LED products, is currently the rapid expansion of the Eurasian market. LEDinside observation of flip chip LED and CSPLED market development experts, has developed the photoelectric company was informed that a series of unique products from Europe, and have the pleasure to interview the founder and chairman of Dr. Chen Jie, talked about the fluorescent powder coating technology and application of CSPLED.

Dr. Chen Jie pointed out that the fluorescent powder film (Phosphor Film) technology, the traditional fluorescent powder coating (Phosphor coating) dispensing method or spraying, as fluorescent powder and glue mixed with the fluorescent powder density is insufficient and uneven distribution in different position, no way to achieve the conversion of optical consistency, uniformity and reliability the degree is not ideal.

A photoelectric fluorescent powder coating adopts dry separation technology, using two different devices, the flip chip LED chip in the vacuum cavity, the phosphor coating process, with semiconductor chip, improve phosphor film uniformity, consistency and reliability. And in accordance with the customer's application needs of the optical, fluorescent powder and glue stack can be carried out layer by layer.

Expert optoelectronic products - double opening fluorescent film for vertical chips

In the process of advanced CSP, using its own patented technology can be very compact fluorescent powder stack, then covered with silica gel, make its products with high bin rate and uniformity of color, and the fluorescent powder can save half. With the general fluorescent powder spraying technology is obviously different, due to the separation of dry and wet way, can order has the fluorescent powder and silicone coating, conformal coating technology and layered deposition (Layer by Layer Conformal Coating), so it can reach the previous similar products are difficult to achieve the color uniformity, light angle is also large adjust the scope of CSP to 120 degrees -170 degrees.

Wafer level fluorescent powder coating service

CSP chip LED products technology the biggest advantage in the flash and backlight market, through the consistency and reliability of phosphor coating conversion promotion, can look forward to the future in the development of the market in the field of automotive lighting. If the use of double color (red KSF and beta -SiAlON green phosphor powder), through the phosphor layer deposition technology, can greatly improve the color gamut range (NTSC colorgamut) to more than 90%, comparable to OLED; the current through the unique design of CSP, but also light angle up to 170 degrees, if used in the lamp market, cost and the price can reach the best effect.

Expert photoelectric products - five - side luminous CSP

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