"FEMC" LED, what the hell is that?

In Zhejiang, Yiwu will invest 2 billion to build an industrial park, continue to expand LED production capacity, we will always go on the road to LED, march forward courageously! "April 20, 2016 in Shenzhen City, blue Ying Bay Resort held the theme of" big, big, big health lighting backlight products "conference, REFOND chairman Gong Weibin forward to participate in the conference of the industry association, dozens of customers and industry and mass media said.

Ruifeng walk in the packaging industry for 16 years, especially in the field of EMC is the force has long. As has been low-key, concentrate on doing research and development of the enterprise, the focus of the conference is still a product, but also the protagonist of the conference - the first domestic launch of FEMC.

What the hell is FEMC?

The concept of FEMC is taken from the "Filp-chip+EMC" bracket, in simple terms, is the use of flip chip and EMC combination of packaging products.

Of course not can be said that the combination of product technology and can get along with people, not to say good friends are good friends, they will not say friendship boat turned over. The product is even more so, not the two technologies together on the line, but the need for long-term research and development to break in.

The FEMC needs to overcome the flip chip encountered in the application of the two reflow, void rate and leakage of dead lights and other issues. Of course, this is only the tip of the iceberg encountered in the development process.

Why do it?

Because the EMC bracket is made of semiconductor etching copper sheet and thermosetting material, the packaged LED device has the advantages of high power, high light efficiency, long service life, low thermal resistance, small size, flexible size, simple application and the like.

But the flip chip chip has, first, lower thermal resistance, can achieve good heat conduction, can reduce the junction temperature, so as to improve the efficiency and reduce the life of resistance; in the same temperature, increasing the input power, so as to improve the output power of a single. Second, better chip light, uniform current distribution, better injection; the back is not blocked, you can do a good job of phosphor coating and light extraction, you can do the surface image, to further enhance the light. Third, no gold (integrated, high-density). It is easy to form a module; the arrangement is compact, and can output higher power density.

In order to fully inherit and develop the EMC bracket and LED flip chip advantage, REFOND joint international well-known equipment manufacturers and material suppliers, according to the traditional semiconductor industry process, using 3D technology, successfully realized in the EMC bracket flip chip package, but also further build a new pattern of LED based devices using flip chip technology.

Fortunately?

FEMC VS SMD

Compared with traditional SMDLED devices, FEMC devices can achieve seamless replacement, and has significant advantages.

First of all, the SMD device chip electrode is located on the light-emitting surface, and the bonding metal lead wire is positioned above the light emitting surface, which absorbs the light output of the chip and reduces the luminous efficiency of the LED. Flip chip devices using the FEMC electrode chip is located at the bottom, does not affect the surface of light; with no lead package directly to avoid the absorption of light by metal wire; chip light emitting surface of transparent sapphire, the refractive index between GaN and plastic packaging and plastic packaging, light matching better, more luminous efficiency. High.

Secondly, formal SMDLED bonding wire weld, prone to surge, high current capacity, and the plastic package caused by thermal mismatch stress fracture and other issues, is one of the weak links on the reliability of LED devices. FEMC reduces the welding process, improves the production efficiency, eliminates the possibility of a variety of reliability problems caused by bonding leads.

Thirdly, the SMD device is generally made of insulating solid crystal, the thermal conductivity of the insulation is low, and it often becomes the hot bottleneck between the chip and the bracket, which affects the LED heat dissipation and long-term reliability. FEMC uses the thermal conductivity of hundreds of times in insulating rubber metal solid crystal material directly between the chip electrodes and the bracket of heat, mechanical and electrical interconnection, not only increased the mechanical strength of products, more greatly reduces the thermal resistance of LED, improve the cooling capacity of LED, so as to guarantee the reliability and service life.

FEMC VS CSP

FEMC compared to the same industry hot spots, flip chip based CSP products, but also has significant technical advantages and application advantages.

First of all, when using the same size of the Flip-chip package, compared to CSP, FEMC out more light, and FEMC has a higher cost performance (lm/$);

Secondly, FEMC has a smaller diffusion resistance, the same chip, with the same current and ambient temperature, the junction temperature of FEMC was significantly lower than that of the CSP junction temperature; in addition, the continuation of the FEMC support package EMC dress, in the end application of lens is rich in resources, excellent customer support, optics, the original SMT production line and process.

What can you do?

FEMC devices in EMC support platform, traditional dress line change for leadless flip chip, and the introduction of automated production lines, has the advantages of high production efficiency, low device cost, high reliability, long service life, easy to use, can be widely used in instruction, display, backlight, lighting and other fields.

If Home Furnishing in the field of commercial lighting, lighting because of the use of non isolated power supply scheme, small power lamp current is 100-150mA, high power lamps with 280-350mA current drive, the drive part of the lamp current larger more suitable for the use of FEMC, such as panel lamp, ceiling lamp, downlight etc..

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