Flip chip big heat Hebei related project passed acceptance

Recently, entrusted by the international cooperation division of science and Technology Department, experts from Hebei provincial science and technology department have accepted the "joint research and development of LED flip chip gluing process technology" undertaken by Hebei banner Optical Technology Co., Ltd. Through reviewing the project technical information, on-site inspection, questioning and defense procedures, the project has been highly appraised by technical experts both inside and outside the province, and has successfully passed the inspection.

Through the cooperation with the Japanese bridge, the international science and technology cooperation project has studied the key technologies of LED chip flip chip gluing process, high performance heat dissipation substrate and anisotropic conductive adhesive, developed a new technology for LED flip chip gluing. The COB light source of the LED flip chip adhesive packaging process is more than normal. The package COB light source accommodates more than 30% chips in the same area, and the total luminous flux has increased by more than 50%. The thermal conductivity of the special substrate has reached 386 W/m.K, greatly improving the heat dissipation performance; 1 patents for application invention, and 3 utility models. Through the development of international scientific and technological cooperation, we have conquered many technical problems such as LED flip chip gluing, established a stable and effective cooperation mechanism, and formed a stable R & D team in the enterprise.

The project effectively solves the technical problems of poor thermal conductivity, poor electrical conductivity, low luminous efficiency, poor reliability, and small number of chips that can be encapsulated per unit area in the existing LED positive chip packaging technology. The technology of LED flip chip bonding will form a new technical route in the field of LED packaging. It is a major technological breakthrough, filling the gap of the domestic LED flip chip gluing process. The application of this technology will replace the normal bonding process on a large scale to achieve the upgrading of LED packaging technology.

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