Flip chip hot Hebei project through acceptance

Recently, the International Cooperation Department commissioned by the Ministry of science and Technology Department of Hebei Province, experts on the acceptance of Hebei banner Photoelectric Technology Co. Ltd. the "LED flip chip adhesive technology joint research and development". Through the review of the project technical information, on-site viewing, questioned the respondent and other procedures, the project has been highly technical experts inside and outside the province, and successfully passed the acceptance.

The international science and technology cooperation projects by making cooperation with Japan bridge, the LED flip chip adhesive technology, high performance heat dissipation substrate, anisotropic conductive adhesive preparation and key technology research, the development of a new process of LED flip chip bonded; COB light source adopts LED adhesive flip chip packaging process than formal package COB light in the same area holds more than 30% of the chip, the total flux increased by more than 50%; special substrate thermal conductivity research reached 386 W/m.K, greatly improving the thermal performance; 1 patents, 3 patents for utility model. Through the development of international cooperation in science and technology, to capture a number of technical problems of LED flip chip adhesive, established a stable and effective cooperation mechanism, in the form of corporate R & D team stability.

The project can effectively solve the existing domestic technology LED chip package thermal suit is poor, poor conductivity, low light efficiency, poor reliability, unit area can package small number of technical problems. LED flip chip bonding process will mature to form a new technical route in the field of LED package, is a major breakthrough, to fill the gaps in the domestic LED flip chip bonding process. The application of this technology will replace large-scale formal bonding process, the realization of LED packaging technology upgrading.

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