Flip chip hot Hebei related projects through the acceptance

Recently, commissioned by the Ministry of science and international cooperation, the Hebei provincial science and Technology Department organized experts on the banner of Hebei Optoelectronic Technology Co., Ltd. LED flip chip adhesive technology joint research and development of the acceptance. Through the review of the project technical data, on-site view, questioning the respondent and other procedures, the project has been highly technical experts at home and abroad, and successfully passed the acceptance.

The international science and technology cooperation projects by making cooperation with Japan bridge, the LED flip chip adhesive technology, high performance heat dissipation substrate, anisotropic conductive adhesive preparation and key technology research, the development of a new process of LED flip chip bonded; COB light source adopts LED adhesive flip chip packaging process than formal package COB light in the same area holds more than 30% of the chip, the total flux increased by more than 50%; special substrate thermal conductivity research reached 386 W/m.K, greatly improving the thermal performance; 1 patents, 3 patents for utility model. Through the development of international cooperation in science and technology, we have overcome many technical problems such as LED flip chip adhesive and so on. We have established a stable and effective cooperation mechanism and formed a stable R & D team.

The project effectively solves the technical problems of the existing LED chip packaging technology in China, such as poor thermal conductivity, poor conductivity, low luminous efficiency, poor reliability, less number of chips per unit area and so on. LED flip chip bonding technology in the field of LED packaging will form a new technical route, is a major technological breakthrough, to fill the domestic LED flip chip bonding process blank. The application of this technology will be a large-scale alternative to the positive bonding process to achieve the upgrading of LED packaging technology.

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