Foot in the field of semiconductor packaging Linsen announced

China LED package announced in 2016 will enter the Dachang Linsen semiconductor packaging, including the entire range of IC packaging. Mu Linsen, executive general manager, said in, into the semiconductor packaging planning, market research this year, officially launched in 2016. Initially will be required for their own IC products as a starting point, starting with a few feet from the body began to enter the package, and then slowly to the foot of a number of packaging products.

Lin Jiliang added, there are a number of semiconductor devices Chinese imported each year, now the situation is Chinese government vigorously support the China semiconductor industry, and our market trends to join the fray. With years of experience in LED packaging, and has accumulated considerable experience in copper, silver, alloy wire pieces. There are a large number of ASM devices can be directly used to produce semiconductor packaging devices. Lin Chi Lian stressed Linsen business philosophy, with the best equipment, the most expensive, the most appropriate artificial material to make the most cost-effective products. I believe that with this production model, will have the opportunity to copy the successful experience in the field of semiconductor packaging.

In the progress of existing Linsen LED packaging devices, by the end of 2014, the number of packages in MLS, LED chip consumes a single month of 23 billion, by the end of 2015 has reached 35 billion in a single month, 2016 is expected to reach 50 billion of the size of a single month. When the capacity expansion to a certain size, will be optimized for the product line, such as the product line does not rule out to expand to high-power LED, COB, or even CSP LED.

The outlook in 2016, Lin Jiliang think LED manufacturers will continue to move toward the direction of price and improve efficiency, so Lm per dollar (Lm/$) is still a 30% increase in space. In the fierce competition in the price of the upstream chip and packaging factory and the elimination of the whole competition.

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