HCS launches new LED drive circuit board

Hercules launched HCS (High Conduction Substrate) with high thermal conductivity substrate heat transfer efficiency breakthrough in ceramic direct copper coating method (DBC Direct, Bonding Copper) production technology, the excellent thermal conductivity and high insulation copper ceramic plate of the use of patented technology fully integrated into a composite plate.

Energy and environmental protection trend, driven by high intensity light emitting diode (HB LED) lighting purposes, high-tech industry said that the current bottleneck in the development of HB lighting LED is facing improvement and break through the cooling system, which serves as the driving circuit of the LED substrate material of the heat transfer efficiency, has been a major breakthrough, market opportunities look pretty.

Hercules Technology (HCS High Conduction Scientific Co., Ltd.) PCB manufacturing R & D team, based on 30 years of experience in leading, Hercules technology chairman Liu Guozheng, has successfully developed a direct method to ceramic copper (DBC Direct, Bonding Copper) production technology, the excellent thermal conductivity and high insulating ceramic sheet in the use of patented technology fully integrated into a composite plate.

Hercules technology chairman Liu Guozheng pointed out that the high brightness LED heat there are still bottlenecks, currently known industry has put into use and improvement of Heat Sink LED packaging technology has a certain effect, but the analysis of the carrier, or FR4 (0.3 W/mK) or aluminum based metal board (1.1~2W/ mK) the poor heat conductivity will not be able to successfully guide to Heat Sink heat radiating function, not perfect, so the combination of fine ceramics, PCB ceramics and metal binding technology, successfully developed a direct CCl (24~170 W/mK), named HCS (High Conduction Substrate) high conductive base plate.

Hercules technology spokesman Xie pointed out that the ESF, named HCS (High Conduction Substrate) with high thermal conductivity substrate, the main characteristic has high thermal conductivity, high insulation resistance and excellent solderability, and may be due to customer demand as the PCB panel manufacturing circuit board material pattern characteristics of various lines, Hercules technology initially applied to be the electronic components with large industrial current (such as solid-state relay, bridge rectifier module) car electronic control circuit board components etc..

It is worth mentioning that the high thermal efficiency of HCS materials can be applied to high intensity light emitting diode (HB LED) cooling system of lighting industry, leading manufacturers LED such as REBEL XLAMP series has been using this material, the property of the materials to improve the thermal conductivity is 20 times, 80 times, FR4 and the metal substrate. The heat conduction material HCS rate is far higher than MCPCB, patented production technology, production cost and competitive industry, believe that LED can help overcome the heat problem can make LED lighting commercialization as soon as possible.

Source: LEDinside