Half the country currently has more than 50% products using lead-free package

National Semiconductor Corporation Ns (National Semiconductor Corporation), has announced plans to achieve production process of lead-free before the end of 2006. In other words, the company will sell all of the integrated circuit will not use leaded packaging. The US national semiconductor is bold to carry out the plan, hoping to take the lead role in the industry, encourage the industry to produce more environmentally friendly electronic parts, so that the material can be easily recycled, so as to protect the environment. In addition to the use of lead in the packaging process, the U.S. National Semiconductor, but also significantly reduce the use of bromine and antimony containing flame retardants.

April 2004, the U.S. National Semiconductor announced plans for the full range of chip products without lead packaging. At present, the company's 15000 analog and mixed signal IC products have no lead packaging for customer choice. Before the end of June 2006, national semiconductor chip products will be sold all adopt no lead package, but has been waived by the exception, show the company's production process in full compliance with the European Parliament enacted restrictions on the use of hazardous materials instructions. But the American national semiconductor to reduce lead with a greater vision, the internal requirements far more stringent than the company's business rules issued by the state. All along, the copper lead frame packaging of the plating layer are used as lead plating. In addition, Micro SMD, PBGA and FBGA array insertion package has always been used as lead solder solder ball. National semiconductor leadframe package is no longer used as lead plating material, and the use of matte tin. Micro SMD package is no longer used as the solder ball solder, and the use of tin silver copper alloy; PBGA and FBGA package is changed to tin silver alloy. After the full implementation of this ambitious plan, the national semiconductor is expected to save about 5 tons of lead per year.

National Semiconductor Production Technology Department of the central executive vice president Kamal Aggarwal said: "the national semiconductor is non leaded package technology leader, we develop innovative high performance products, will ensure the development of environmentally friendly and recyclable products."