Hercules launched HCS (High Conduction Substrate) with high thermal conductivity substrate heat transfer efficiency breakthrough in ceramic direct copper coating method (DBC Direct, Bonding Copper) production technology, the excellent thermal conductivity and high insulation copper ceramic plate of the use of patented technology fully integrated into a composite plate.
Energy and environmental protection trend, driven by high intensity light-emitting diode (HB LED) lighting purposes, high-tech industry said that the current bottleneck in the development of HB lighting LED is facing improvement and break through the cooling system, which serves as the driving circuit of the LED substrate material of the heat transfer efficiency, has been a major breakthrough, market opportunities look pretty.
Hercules Technology (HCS High Conduction Scientific Co., Ltd.) has been successfully developed on the ceramic direct copper method (DBC Direct, Bonding Copper) production technology, the excellent thermal conductivity and high insulation copper ceramic plate of fully integrated into a composite plate with patent technology.
Hercules technology, high brightness LED heat there are still bottlenecks, currently known industry has put into use and improvement of Heat Sink LED packaging technology has a certain effect, but the analysis of the carrier, or FR4 (0.3 W/mK) or aluminum based metal board (1.1~2W/mK) thermal conductivity will not be too bad heat Heat Sink successfully guided to the heat radiating function, not perfect, so the combination of fine ceramics, PCB ceramics and metal binding technology, successfully developed a direct CCl (24~170 W/mK), named HCS (High Conduction Substrate) with high thermal conductivity substrate.
Hercules technology pointed out that the name HCS (High Conduction Substrate) with high thermal conductivity substrate, the main characteristic has high thermal conductivity, high insulation resistance and excellent solderability, and may be due to customer demand as the PCB panel manufacturing circuit board material pattern characteristics of various lines, Hercules technology applied to the initial required by electronic components with the industrial current (such as solid-state relay, bridge rectifier module) car electronic control components such as circuit board.
It is worth mentioning that the high thermal efficiency of HCS can be used in high intensity light-emitting diode materials (HB LED) cooling system of lighting, LED manufacturers such as REBEL series XLAMP series has been using this material, the property of the materials to improve the thermal conductivity is 20 times, 80 times, FR4 of the metal substrate and the heat conduction material HCS the rate is much higher than MCPCB, patented production technology, production cost and competitive industry, believe that LED can help overcome the heat problem can make LED lighting commercialization as soon as possible.
Source: LEDinside
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