How to solve the analysis of mixed bin LED package to upgrade the standard?

[LED] - the survival of mankind cannot do without light, before the nineteenth Century Edison invented the electric light, human lighting is very simple, that is the direct use of direct light fire sources, such as candles, lamp etc.. These long years have been buried in the Museum of history. With the progress of human beings, the 20 actual industrial revolution broke out, and Edison invented the incandescent lamp as the mainstream lighting products into the era of human lighting.

However, with the continuous progress of human society, after the emergence of incandescent lamp, power lighting equipment has experienced three stages of fluorescent lamp, high intensity gas discharge and LED light source.

In these three light sources, the latest LED light source, and with the development of semiconductor technology and the needs of global energy conservation, environmental protection, governments in particular, the Chinese government's strong support for the LED lighting industry. Mainland China from the upstream of the LED to the middle reaches of the LED packaging, and then to the downstream of the LED lighting industry development by leaps and bounds, a variety of lighting companies can be described as a hundred flowers bloom. The current LED wafer epitaxy, particle packaging or lighting applications, we are in the price war. LED lighting products have gradually evolved from commercial lighting, outdoor lighting to indoor lighting, slowly approaching civilian lighting. LED products because of its energy saving and environmental protection, long life and other advantages and product price decline is favored by the vast number of consumers.

LED lighting products are gradually accepted by the majority of consumers, however, the actual application of LED particles in the process of lighting products relative to the current fluorescent lamp products are not very mature. Some problems will be encountered in the actual production. For example, spot, color, dark area, light transmittance, PC cover drawing, etc.. One of the main spots, dark areas and institutional design, LED particles in the layout of the circuit board will have a great impact. The LED color tolerance is also a major problem plagued LED lighting factory.

At present, LED packaging companies for light color particles of LED particles on the ANSI standard, the domestic particle can also cooperate with the downstream lighting factory to do IEC bin, and some international companies will not cooperate with the basic needs of domestic customers. But the IEC also launched a new national standard specification, also LED downlight, bulb and other requirements, some SDCM made clear requirements, but the center coordinates ANSI and IEC values of X/Y are different, so according to the current ANSI spectrophotometric color particles can not meet the requirements of gb. Due to the national standard and European regulations in September this year will be formally implemented. So for the LED application Lighting Factory is concerned, LED particle packaging plant can not immediately cut the specification to the IEC standard (due to the difference of the company's machine), it is difficult to produce products in line with gb. Of course, this is not entirely impossible, is now a more practical way is to LED particles in the actual patch production in accordance with a certain proportion of mixed bin production. A domestic packaging factory in accordance with the ANSI standard color temperature 3000K partition as shown in Figure 1 (quadrangular) differences and national standard of macadam. Among them, only the B color and D color and IEC color tolerance elliptical intersection, respectively, accounting for about 3/4 and 1/2, and A color and C color and the intersection of the ellipse is very small.

Figure 1

Figure 2

The above figure 2 for the packaging factory shipments to the actual shooting map Lighting Factory A, B, C, D four bin color temperature (for each machine factory, the actual package A, B, Zhang C, D to bin lighting factory after coordinates will offset) if SMT direct material operations, this is the whole lamp color tolerance SDCM is greater than 7, so the need for mixed bin production. After the experiment according to a certain proportion of mixed bin will reach SDCM < 7 effect.

From the mixed bin test results, the A, B, D three bin 1:1:1 mixed with the best effect, followed by A, Dbin mixed, and finally for A, C, Dbin mixed.

So to sum up, SDCM < 7 lighting factory to provide material requirements even if not completely beads factory, based on the actual production of a mixed bin combination also can achieve the effect of the finished SDCM < 7, the mixed bin can even consider the different color temperature color temperature of bin according to the proportion of mixed bin to meet the SDCM requirements, but to note that the naked eye is a color difference, this is going to take control of the actual production.

Currently requires all suppliers immediately switch to meet the requirements of SDCM standard is almost impossible, but most of the particles packaging products not only sell to domestic customers do lighting or lighting customers sold to Europe, they will still be sold to a large North American customers, while under the inventory pressure lamp factory also not too willing to do GB and ANSI two systems. So in this embarrassing situation, mixed bin production is undoubtedly the best way. (author: Feng Shaoming)

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