Infineon ultra 900 million acquired "cold cutting" technology company for SiC wafer cutting.

In November 13th, Infineon announced that it had acquired a start-up company called Siltectra, earning an innovative technology (Cold Spilt). "Cold cutting" is an efficient processing technology for crystalline materials, which can minimize material losses.

Infineon will use the technology in cutting silicon carbide (SiC) wafers, so that the number of chips that can be produced from a single chip can be doubled. It is reported that this acquisition has been approved by major shareholder MIG Fonds venture capital, the offer is 124 million euros (equivalent to about 975 million yuan).

It is reported that Siltectra was founded in 2010, is a start-up company in Dresden, has more than 50 patents intellectual property portfolio.

Ying Fei Ling, CEO Reinhard Ploss, said: "the acquisition will help us to make use of SiC new materials and expand our excellent product mix. Our understanding of the thin wafer technology and unique expertise will complement Siltectra's innovative capability and cold cutting technology. "

Compared with the conventional sawing technology, Siltectra has developed a new technology for decomposing crystalline materials, which can reduce material loss to technology. The technology is also applicable to carbon SiC and will be industrialized in its existing Dresden plant and Infineon (Austria) Villach plant.

Cool Split technology for wafer cutting (source: Siltectra)

As the only company that produces 300mm silicon thin wafer, Infineon can well apply thin wafer technology to SiC products. Infineon is expected to move to mass production in the next five years.

With the passage of time, cold cutting technology is expected to be more widely applied, such as ingot segmentation, or materials used outside SiC.

Ploss also hopes that the technology will help improve its economic and resource use, especially in the current growing electric vehicle business. Today, SiC products have been used in highly efficient and compact solar inverters. In the future, SiC will play an increasingly important role in electric vehicles.

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