JCDecaux formation and Nitto sign the agreement, involving CSP fluorescent film technology etc.

JCDecaux formation and ensequence signed an agreement to undertake the second generation type package CSP fluorescent film technology (Conformal Coating CSP) the localization of development and services. With ensequence agreement involving 39 patent right, acquisition of Nitto LED division part of R & D and production equipment, 50um thin film fluorescence processing technology and other content, including material thin film with special fluorescence Dow Corning silicone. With ensequence Group Marketing Strategy Center is inclined to the medicine and health field, group LED Department announced in October this year to completely withdraw from the domestic and overseas markets (Japan). In order to fulfill the responsibility of the market and enterprise, ensequence is located in Zhongshan, Guangzhou, to Foshan, Baoan's four users to transfer 400um thick film technology and pressing the fluorescence CSP method, and 50um thin film technology and promote the localization of the implementation agreement to jcdecaux. The day before, has been receiving equipment and JCDecaux into East into film production line is in construction.

Compared with spraying, printing, Molding CSP packaging technology, fluorescence glue film material B-Stage technology with phosphor encapsulation layer distribution is uniform and stable, low shrinkage, packaging equipment investment output ratio based on the advantage of higher. JCDecaux formation and ensequence almost at the same time since 2012 began the development of fluorescent film technology. The technical route for silicone and JCDecaux fluorescent powder obtained by mixing roll film high degree of B-Stage intermediate materials; ensequence based on thixotropic powder mixed with low degree of B-Stage solidified membrane technology. Both materials need to be sealed CSP vacuum pressing equipment and necessary tools to achieve.

The single white light around the white wall is CSP, which is used for directional light source and TV backlight. The white glue film is combined with fluorescent glue film, and the two time press fit can realize low cost single face out encapsulation. The formation of JCDecaux is actively improving development of related materials and technology and equipment.

At present, the CSP1313 structure is gradually popularized, the overall thickness is 350um, and the encapsulation layer above the chip is 200um. The structure has been rapidly recognized in the market for intelligent dimming and other lighting applications. But in the field of television backlighting, the structure is difficult to use through more than 600mA high current applications, too thick adhesive layer causes junction temperature rise, or even burst. The utility model is used in the field of flash lamp, which causes a circle of Huang Guangyun phenomenon and affects the photo taking effect because of the different optical path of the vertical out light and the oblique light passing through the fluorescent layer. If the fluorescent packaging material of the coated chip can be controlled at 50-100um, the two problems can be solved in terms of heat dissipation and optical effect. Therefore, the development of the fluorescent film to the thin layer is an important step in the improvement of the CSP structure.

Conformal bonding CSP includes several key technologies: organic silicon basic material development, ultra-thin fluorescent film manufacturing, vacuum laminating equipment and fixture. To undertake ensequence in JCDecaux existing technology platform, and deepen cooperation material application technology continuous development of Dow Corning, film production technology and CSP.

2017 is the first year of the real LED CSP, JCDecaux formation committed to cultivating the fluorescence glue film manufacturing technology, intelligent dimming lighting, television, mobile phone, mobile phone backlight Wafer Level flash chip vertical LED users with fine CSP solutions.

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