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Japan has developed LED modules that meet high output power requirements

Japan Tanaka Kikinzoku Industrial Company and S.E.I company announced on April 4, 2016, containing gold particles (0.1 M) of the low temperature bonding material "AuRoFUSE", developed can meet the requirements of high power LED module. The output power of LED lighting will decrease as a result of the heat generated by lighting, so there is the problem of how to improve the heat dissipation in the LED module. And this new product solves this problem.

Module example. Photo out and photoelectric research and S.E.I.

The specific method is to use AuRoFUSE as bonding material for flip chip bonding, rather than the current mainstream approach - wire bonding. Flip chip bonding is the terminal protrusions (bumps) chip is connected to a lead frame and method of substrate in electrical mode, directly to the LED chip bonding to the substrate as a light emitting surface heat near the substrate, it is easy to make the heat. In addition, by removing the lead wire, the space occupied by the lead can be omitted, and the miniaturization can be realized, and the electrical characteristics can also be improved.

Construction of newly developed modules. Pictures from Tanaka, precious metals and S.E.I.

However, in the past for flip chip bonding, must use expensive aluminum nitride on a substrate. This is because the low price metal substrate and LED chip thermal expansion coefficient is very different, the joint is easy to damage. In this technique, the AuRoFUSE, as the bonding material, contains gold particles, which can relax the deformation during thermal expansion, so the inexpensive metal substrate can be used. With this technique, high output power and miniaturization of LED modules can be realized.

Tanaka precious metals will be on April 6, 2016 at the Ming International Convention and Exhibition Center in Tokyo, "the third high functional metal Exhibition" in Japan, through the company's booth to display the LED module. The company's future goal is to extend the use of the LED module to the import and export frozen warehouses, as well as in the areas of vehicular lighting that can be miniaturized.

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