Japan has developed a LED module that meets the requirements of high output power

Japan Tian Zhong precious metal industry company and S.E.I company announced in April 4, 2016 that using the low temperature bonding material "AuRoFUSE" containing gold particles (0.1 u m grade), a LED module that can meet the high output power requirements is developed. Under the influence of the heat generated by the light in the light of LED, the output power will decrease, so the LED module has the problem of how to improve the heat dissipation. This new product has solved this problem.

Module example. Photo from and optoelectronic research and S.E.I.

The specific method is to use the AuRoFUSE as the bonding material for the flip chip bonding, not the current mainstream way - the lead bonding. The flip chip bonding is a method to connect the chip to the lead frame and substrate by electrical mode by using the protruding terminal (convex block). It directly connects the LED chip to the substrate. As the source of the heat source, the luminescent surface is close to the substrate, so the heat is easily exuded. In addition, by removing the lead, it can not only save the space occupied by the lead, realize the miniaturization, but also improve the electrical characteristics.

The construction of the newly developed module. The picture comes from the precious metal and S.E.I in the field.

However, expensive aluminum nitride must be used on the substrate in the past. This is because the thermal expansion coefficient of the metal substrate with low price is very different from that of the LED chip, and the joint is easily damaged. In this technology, the AuRoFUSE, as the joint material, contains gold particles, which can ease the deformation of the thermal expansion, so the low price metal substrate can be used. With this technology, the high output power and miniaturization of the LED module can be realized.

The LED module will be displayed on the "third high functional metal exhibition of Japan" in April 6, 2016 at the International Exhibition Center of the Ming International Convention and Exhibition Center in Tokyo. The company's future aims to extend the use of the LED module to the import and export frozen warehouse and vehicle lighting that can be used for miniaturization.

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