Japanese factory Disco developed for LED sapphire substrate chip processing technology

Japan di CISCO (Disco) developed for the LED sapphire substrate chip processing technology. The company called it the "sapphire substrate Stealth Dicing Process". The technology is characterized by the fact that the quality and the yield of LED can be considered at the same time.

The method of cutting the sapphire substrate with diamond scribing device depends on the technical level of the operator. Therefore, the use of laser cutting sapphire substrate has become the main method, the company had also launched a laser scribing (Laser Scribing) device. Laser scribing, can be fully automatic high-speed processing, improve the yield. However, compared with the method of diamond scribing, there is a problem of low LED brightness in laser scribing. Therefore, by using the Hamamatsu Photonics (Hamamatsu Photonics) laser chip technology "Stealth Dicing", to solve the problem. Therefore, under the condition of not reducing the yield, the brightness of the LED is controlled. Can also cut the thickness of more than 100 m epitaxial film.