LED heat dissipation Ceramic Metallization Technology

Ceramic material because of excellent insulation, heat resistance and stability of innate characteristics, so is widely used in the insulation of electrical equipment, and because the ceramic metallization technology, in recent years it has been used in LED ceramic substrate and carrier board line laying. The metallization of ceramic materials is mainly divided into DBC (Direct Bonded Copper) and DPC (Direct Plated Copper). However, with the use of narrow elements, dimensional accuracy and more precise, the existing DBC process have been inadequate, so the majority changed to DPC as ceramic metal as the main technology, so DPC technology is becoming more and more popular.

Technology DPC ceramic metallization, which contains "sputtering" and "yellow light" and "developing" and "plating" of the electroforming process, in which "sputtering" effect on the strength and stability of the line most affected. Sputtering is a plasma physical vapor deposition, when the inert gas cavity by energetic electron impact the formation of positively charged ions, the ion impact electric field acceleration to the solid surface, due to extrude the shift out of the collision and the target surface under the strong kinetic energy of atoms, atoms, forming a thin film on a target substrate the final mosaic, this phenomenon is called "sputtering".

General sputtering process directly between the applied DC voltage, usually by gas "glow discharge effect, positive ion beam hit the target atoms, but only the electrons in the gas along the electric field direction for linear motion of the road, in a vacuum and gas collision probability is low, not a lot of the free gas to be accelerated to produce sputtering, resulting in reduced efficiency of sputtering. In order to improve the gas dissociation rate and splash plating efficiency, usually with annular magnetic field closed on the target, let electronic "Lorenz force", it will be in a spiral around the field lines along the path, and increase the number of collisions and improve gas plasma ionization rate, this way is called "magnetron sputtering".

Film by magnetron sputtering deposited on the substrate is usually very thin, so the substrate itself needs to rely on strength to support, so the adhesion with the substrate is particularly important, while the film and the substrate bonding strength mainly depends on the material interface, so the bonding strength of thin films can also be called "interface strength". With the strength of the film is decided not only by one side, but also associated with the type of interface on both sides of the material, the surface properties of materials on both sides when the difference is too large, the intermediary layer must add a layer of material properties are similar and both sides to increase the bonding strength of ceramic materials, usually more use of Ni, Cr, Ti and W elements as the intermediate layer in order to increase the stability of the line. In addition to the above methods, it can also be used to reduce surface contamination and adjust parameters to reduce the micro defects and stress concentration of the coating, so as to enhance the strength and the strength of the ceramic substrate and the circuit.

Sputtering method not only is not affected by the hardness of the material melting point, can be widely used in various materials, but also has very good adhesion with the substrate, so it has been imported into DPC ceramic metallization process of a large number of. Therefore, in 2009, passive film process Dayi technology to more than ten years, the group level of magnetron sputtering machine production transition heat LED ceramics, in addition to diversified solutions for customers all kinds of R & D of high power LED heat radiation, and with the most rapid, most reasonable price and the most diverse products available to manufacturers put together, expect LED to promote green energy, and to use LED to save the earth's carbon reduction and all mankind.