Latticepower Liang Fubo: no support will be the trend of CSP

"The packaging technology of the next generation of CSP, and no CSP support is the trend, but the key is how to solve the reliability problems with non support mode." In December 21st by the state assembly's LEDinside and LED Chinese consulting network jointly organized the 2018 LED market analysis will be prospective (ShenZhen Railway Station), latticepower (Jiangxi) Co., Ltd. vice president Liang Fubo in the theme of "the development of CSP and discuss the future trend analysis" said in the speech.

With the development of chip technology and the market for higher brightness requirements, various types of packaging technology came into being. From the early pin package, surface mount package, power type package, COB package to later, then to today's CSP.

CSP (Chip Scale Package) is a chip scale package from the evolution of IC packaging technology and. CSP LED refers to the package size is less than 1.2 times the size of the chip package, the main structure can be divided into stent (pseudo CSP) and without support, can be divided into single light (small angle light) and five surface emitting (large angle light). According to Liang Fubo introduction, support CSP in flip chip pad under a small ceramic substrate, at present, China Star, sferic billion light, new century has the production support CSP devices, without the support of CSP, on behalf of manufacturers including Samsung, Seoul, Lumileds, EPISTAR, Saman, BDO, Nichia, OSRAM and energy photoelectric etc..

Five surface emitting CSP refers to fluorescent powder silica / fluorescent film pressing cover, flip chip top and around five surface light; or phosphor conformal coating covering around the chip at the top and then transparent silicone plastic, five light. While one side emitting CSP refers to the flip chip around the white walls, the top phosphor fluorescent film / silica gel pressing, single out

Light.

In addition to the above two kinds of mainstream CSP structure, Liang Fubo also talked about the composite reflecting cup structure of CSP technology, the industry can realize mass production with latticepower and arias.

Comparison of three kinds of CSP technology, has its advantages. Five surface emitting CSP with high light efficiency, light angle, side emitting CSP two to optical design, illumination center strong, but there are not enough brightness, over reliance on the chip flip chip technology, is easy to crack problems. The composite reflective cup structure of CSP, and has a single light, high brightness characteristics. Composite material for flip chip protection, greatly enhance the reliability of CSP. To reduce the risk of failure in the process of using application side.

Based on single LED flip chip the same under the condition of composite reflective cup structure of the brightness of the highest score, followed by five surface emitting. From the color of the package when shooting, five light can order 5-7, can achieve 3 order single light, the new composite reflective cup structure can achieve 3 order and the yield can reach more than 99%. Compared with the traditional packaging, especially improve the light quality requirements, the composite reflective cup structure of CSP can significantly reduce costs.

CSP is a package of important form, in recent years has attracted much attention in the industry, but also the most controversial technology. Liang Fubo pointed out in his speech, the CSP core is the most important flip chip, CSP LED flip chip yield improvement, light efficiency, brightness improvement and cost reduction. The development of CSP technology, has high reliability, high cost, low thermal resistance, high driving current, high optical density and other advantages; at the same time also encountered some confusion, such as not easy to use, easy problems, high cost of substrate, patch, brightness is not enough, which leads to the application of CSP only in special fields. Several mobile phone flash, TV backlight etc.. For example, Lumileds CSP LED applied to flash, each month shipments reached 50 70KK; the use of Samsung and CSP in Seoul LED in part on the back; the second half of last year, CSP LED also began to be used in some post installed lights.

However, the CSP technology is facing a public confusion, we should first solve high, high reliability and high efficiency. High reliability mainly involves two aspects, namely with / without support of the dispute and the flip chip stability and enhance the ability of fighting against. Support CSP is easy to solve the reliability problem, but the cost is too much. Liang Fubo believes that no support is the trend of CSP, but the key is how to solve it by way of a bracket reliability.

The most important is the price, performance, or light effect. Liang Fubo, the current light effect size above 1530mil flip chip has gradually exceeded the dress chip. The other is a low cost, the flip chip chip is still expensive dress price than 30%-40%, but the actual cost can be controlled to you about 10%.

As a global silicon substrate LED technology leader, latticepower in 2013 began the development of CSP, in 2014 to achieve five surface emitting CSP production, five surface emitting traditional CSP has great limitations. At the end of the same year decided to stop five surface emitting CSP, and to develop a new generation of composite material reflecting cup structure of CSP, released in December 2016, and has been used in mobile phone flash, TV backlight, automobile headlamps etc.. Liang Fubo said that the current latticepower CSP products including CSP1717 (1W 3W), CSP1919 (1W - 4W) and CSP2121 (2W - 5W).

"For the entire industry, CSP technology is still in the state." Liang Fubo said, "CSP is not a packaging factory and chip factory who do the problem, need to force to promote the industry together, find their own position in which has many advantages of CSP will occupy a space for one person in the LED lighting market."

NICHIA 1W and 1W forecast the current large package of products all in the future have the opportunity to be replaced by CSP. If the above problems have been solved, CSP is widely used in high power bulb, commercial lighting, industrial lighting, indoor lighting and outdoor lighting etc..

About latticepower

Latticepower was founded in February 2006, is a Jinsha River venture, Mayfield, Temasek, Asia Pacific Resources International, wind and other well-known investment business investment, focus on LED technology and product development and production of high-tech enterprises. At present, the registered capital of 123 million US dollars. The company has international R & D team, advanced manufacturing and large-scale production management, production, R & D and supporting the existing plant area of more than 40000 square meters, invested more than 1 billion 500 million yuan.

Latticepower is China high-power LED industry leading enterprises, the leading global silicon substrate LED technology. The silicon substrate LED technology innovation has 330 patents in the world, won the 2015 National Technical Invention Award, is the world's third Blu ray LED technology roadmap. The company is committed to provide consumers with a full range of high-end LED lighting products and solutions. (text: LEDinside Nicole)

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