MIIT Guan Baiyu: LED packaging technology is currently the biggest challenge

Recently held in the second quarter of 2010 Chinese electronic information industry operation cum TV industry research quarterly conference, Ministry of industry and electronic information division deputy inspector Guan Baiyu said, we need to make the LED challenge in the package, because light and heat are together in a field device. We hope that the characteristics of the LED luminous efficiency can be done better, more light and less heat, which is our pursuit.

Bai believes that the heat to the LED device has the greatest impact, if the total temperature in the case of lighting, it will greatly affect the lighting device or a lamp life. So in this regard, in terms of the packaging structure, LED lighting presents a severe challenge.

Guan Baiyu said, we need to meet the requirements of heat and shape in packaging materials, in addition to know something, not to do something, the key is to enhance the number of materials and short-term independent development projects.