OSRAM is working with seven manufacturers to improve the LED part of the manufacturing process

OSRAM photoelectric semiconductor alliance with seven partners of science and industry, from December 2014 to February 2018, participated in the InteGreat research project sponsored by the German Federal Ministry of education and Research (BMBF), and studied the methods and related technologies of the LED production process, and improved some of the manufacturing processes.

OSRAM launched planar interconnection technology (source: OSRAM official network)

In the process of participating in the study, seven manufacturers make in-depth research on the manufacturing of small LED chips, as well as packaging technology, to find alternatives. The most important of them is the wafer level packaging technology and the research on the plane contact.

Through this program, researchers have developed a number of new technologies, one of which is plane interconnected technology, replacing wire wires with thin and flat metal wiring, which can move the surface of the LED to the surface of the package, effectively improving the luminous efficiency and reducing the cost of use.

The research results can be applied to research and development products and production, and integrate LED in industrial application to promote the mobility of future applications. It can not only be applied to large size TV walls, but also can be used in surrounding lighting and sensing systems, and can promote the potential market for information entertainment.

For more information on LED, click on the LED network or pay attention to the WeChat public account (cnledw2013).