Package people look at CSP: is it true or false?

Changes in the market and technology updates continue to give birth to a new packaging process and form, however, in the case of traditional packaging dominant, COB, EMC, CSP and other technical prospects remain uncertain.

The improvement and innovation of traditional package based on COB and EMC technology to show their skills, but did not constitute a real threat to the packaging manufacturers, even at the cost, light efficiency and other advantages, the birth of CSP concept and technology has brought changes to turn the world upside down especially in LED packaging industry.

In semiconductor technology has been developed into the LED industry is now slowly mature, with the process of simplifying and "free packaging" of the voice is getting higher and higher, in the middle of the packaging manufacturers will go in the future? For this package of "revolution" fears are unfounded?

CSP re fire packaging technology is still flourishing

Relying on COB, EMC, flip chip packaging technology will be more and more inclined to the development of the market segments, according to their technical characteristics will slowly find the right direction.

The future market will be more and more specialization, more suitable for CSP and not suitable for the lamp from the lamp optical, EMC&PCT is more suitable for small and medium power cost-effective products, ceramic package is suitable for small size and high power products and so on, even if the CSP technology is mature, after all in size could not reduce the endless. There will still be a bottleneck, packaging manufacturers market survival is still very impressive.

- Rui Rui, deputy general manager of R & D Zhang Zhicong

Different package types have the cross, each one has his good points, the characteristics of each application package.

Package can not be free, LED package will still be a hundred flowers. The high-end commercial lighting field, COB in light color quality can be better than other packaging; application in auto lamps, has started to flip in the fluorescent tube and display skills to the full; bulb lights, Home Furnishing lighting field, EMC may still be thriving.

- Wang Mengyuan, general manager of Foshan Hao Photoelectric Technology Co., Ltd.

Packaging manufacturers still have considerable advantages

To master the advanced technology of semiconductor chip manufacturers, such as Samsung and Seoul semiconductor, has been in the hope of replacing the packaging process and materials, introduce more cost-effective chip products, so as to satisfy the food market share.

The biggest advantage of CSP chip package is made smaller and smaller and the optical collocation of the light source is increased, the flexibility of space, potential cost reduction is greater, and because it is directly removed a package interface (stent or substrate), also has advantages on cooling.

CSP usually flip chip or vertical structure chip, can be used to drive higher current density, the higher the luminous flux per unit area.

Although the advantage is obvious, but the Shaoxin actinoelectricity executive vice president Wu Dake said, compared with the accumulation of technology and management idea of traditional packaging manufacturers long explored by CSP technology from theory to the scale of production in a short period of time still has the advantage not very enough,

Even if the CSP occupy the leading position in the industry, the traditional packaging technology is still useful, some small and medium enterprises will gradually transition to the downstream lighting application, technical package can rely on the advantage of human capital companies closer to the semiconductor industry, these are enterprises in other industries which are not some congenital conditions and advantages.

In recent years, the chip industry gross margin continued to decline sharply, Wu Dake admitted that this year prices will continue to decline, but will gradually slow down, because some of the basic materials are close to the limit.

Especially when using the CSP package, the cost of BOM chip, accounted for 8 into above, in the price for the first moment, CSP future price advantage is particularly attractive, so as to provide more competitive enterprise technology direction upstream source for downstream customers.

Big companies have the pressure of technological development, and strive to take the lead, so the chip manufacturers are bound to promote the development of this kind of pioneering and revolutionary technology to form a joint force.

Of course, its large-scale application is still based on the late market environment, supporting the construction of a series of factors to consider, packaging manufacturers can use this time to find a suitable space for their survival and development".

In the true sense of the packaging is not possible"! Any industry chain, a process can not solve all the problems, the integration of industrial chain is feasible and optimal price path choice, the market needs to be verified and not "some concept gimmick" say.

- Li Cheng, deputy general manager of star optoelectronics, R & D center director Dr.

CSP in the next one or two years, although the growth will be faster, but not necessarily accounted for the major share of the market, after all the power in the patch of SMD products, COB, high power ceramic has matured and widely accepted by the market, will still account for most of the market.

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