OKI data and its engaged in LED business Oki digital image (ODI) Co developed a long and wide and 600dpi paragraph the same, but the size of the 1200bpi of the LED print head, and has begun mass production. By using the ODI development of the epitaxial film bonding (epifilmbonding) technology to achieve miniaturization. The technique is to remove the epitaxial layer of the light from the compound semiconductor, and then use the intermolecular bonding force to bind to the silicon driving IC.
Development of the LED print head driver IC wiring diagram
In addition, in addition to reducing the size of the driver IC, the two companies also plan to use wire bonding (wirebonding), reduce the installation of chips and improve LED materials and other measures to reduce costs.
Contact: mack
Phone: 13332979793
E-mail: mack@archled.net
Add: 3rd Floor, Building A, Mingjinhai Second Industrial Zone, Shiyan Street, Baoan, Shenzhen,Guangdong,China