Samsung developed the world's first 8 core chip packaging technology

Agence France-Presse in Seoul in January 10th news of the world's largest chip maker Samsung said it has developed 8 seed core chip package the world's first applied to high-end mobile devices (MCP) technology.

Samsung said the new MCP solution can make the thickness of only 1.44 mm package of the overall capacity of 3.2g, the new generation of mobile phone and mobile devices will be able to provide more services and faster Internet speeds.

"8 seed core MCP is a new solution to a high compression and high capacity development, it is possible to create a new generation of mobile applications." Samsung said in a press release on Monday.

"It will for mobile phone and other intelligent devices, providing more powerful functions from the player to the game machine and high-speed Internet access."