Six LED packaging form unstoppable who will dominate?

LED packaging as the upstream and downstream end of the connection point, plays a key role in the link between the preceding and the following. In LED, high efficiency power, high reliability and low cost of development, the packaging requirements increased. As a result, the packaging industry in recent years has been in the rapid development of new materials, new technologies and the development stage, emerging packaging forms, technologies emerge in an endless stream, such as EMC, COB, flip, CSP...... Who will be king?

Emerging packaging form a hundred schools of thought contend

Business according to darling - COB

COB technology has the advantages of soft light, simple circuit design, high cost efficiency, saving system space, significant heat dissipation, high packaging and output density, etc.. Although there are still technical problems and the chip integrated brightness, color temperature and system integration, but it brings the effect of improving the quality of light is currently on the market a single high power devices unmatched, has considerable development potential for LED light source in the lighting market.

Therefore, the global LED packaging companies continue to upgrade the COB packaging technology, continuous optimization of the COB light source product life, reliability and critical luminous efficiency. MCOB, AC-COB, flip COB, known as "high quality, high efficiency, high cost" emerging COB technology emerges.

It is understood that the ball bulb COB packaging has occupied the LED bulb market around 40%. Its obvious advantages in the field of commercial lighting so that it has become the mainstream direction of the current lighting solutions, the future or will become the mainstay of packaging.

King of price - EMC

EMC is actually a packaging material changes. It has high heat resistance, anti UV, highly integrated, high current, small volume, high stability, has outstanding advantages in the field of outdoor lamp bulb heat demanding field, against the VU requirements of relatively high requirements and high stability of the backlight field.

EMC since the introduction of the use of LED in the field of packaging in 2014, in the indoor lighting has been developed rapidly, and SMD and COB quickly become the mainstream products.

It is understood that EMC currently has 3030, 5050, 7070 and other models, of which the price of 3030 has been very prominent, light and COB is almost the same. And 5050, 7070 can be replaced by 3-7W, 7-15W COB products, and can make the light source cost savings of more than 30%.

Then there is an upgraded version of the EMC - silica gel SMC, heat resistance, anti UV properties than EMC epoxy material to enhance a grade, the future may be applied to flip chip. Although the cost of upgrading power but also increase, and the production process can use the original packaging technology EMC.

At present, the street lamp manufacturers have been gradually introduced EMC, SMC packaging products, the future will have a place in the application of small and medium power.

High power advantage - flip chip

The flip chip has advantages of small size, high reliability, performance enhancement, fast heat dissipation, but the early development of the cost and other reasons, the downstream terminal market remained silent, in recent years the technological breakthrough to the increasingly wide range of applications, market share increased rapidly. Most of the packaging enterprises have this packaging technology as the focus of research and development, innovation.

At present, flip LED technology in high power products and integrated the advantages of a large package, but in the application of small and medium power, cost competitiveness is not strong, and the process is brought to subvert the front end equipment costs also need a period of time to digest.

Backlight Market speed - CSP

CSP is a package form no ground for blame, the packaging industry the most talked about it, low light efficiency, difficult welding, light color consistency, the cost price is high, but the light emitting surface small, high optical density, uniform color, small size increase flexibility, cost decreased by end potential of space, especially in LED, LED ball bubble lamp the lamp with excellent design flexibility, become the major companies competing to grab the blue ocean market.

At this stage, CSP backlight in the field of LED, the market share of the mobile phone flash market is to maintain growth, but there are still few enterprises in the field of lighting to achieve mass production. Because in the premise of the same light effect, CSP whether it is light or cost-effective for mature SMD power is still not obvious advantages. At present, most of the CSP is based on the flip chip development, and the flip chip yield and light efficiency has not yet reached the effect of the chip. At the same time, the production of CSP enterprises is not enough, the scale effect is not obvious, the cost can not be reduced to the popularity.

High color consistency - RP

(remote fluorescent packaging technology) the relative performance of RP packaging technology is more prominent: one is the fluorescent powder from LED chip and phosphor is not easily affected by the heat of the PN junction, extend the life of the light source; the two is the structure design of fluorescent powder is removed from the chip to improve the light emitting efficiency of light. Three color space distribution is uniform, high color consistency.

In recent years, the remote encapsulation technology of ultraviolet excitation caused the people's attention, compared to the traditional UV light source, the one and only have advantages, including low power consumption, fast response, high reliability, light radiation, high efficiency, long service life, no pollution to the environment, the advantages of compact structure. But at present relatively slow progress, R & D investment in a small number of enterprises.

Highly integrated - AC LED

This year, SMD+IC, AC-COB become the main packaging companies to push the product, the domestic packaging enterprises are particularly prominent. It seems that the packaging is no longer the main push package, but the 'cross' do AC module, do the integrated light source".