Stent flip chip is a revolutionary technology in packaging industry?

Very not easy, LED do today, the Dragon Boat Festival holiday did not spend time with their families, but to do the exhibition here, do exchange. "

In LEDinside, China LED hosted LEDforum2016 China international LED market trends Forum, REFOND CTO Pei Xiaoming in such an exclamation introduced today he's theme "scaffolding" FC-LED packaging products, this saying is the entire LED industry, but also in that he and the theme of today's speech support flip FEMC.

The definition and relationship of bracket flip chip and FEMC

As we all know, the current LED chips are generally divided into 3 kinds of structure, the first is a formal chip, the second is a vertical chip, the flip chip is the third - FC-LED, and currently the majority of the formal chip.

The majority of the formal occupancy, does not affect the development of inversion. Although the market share of flip chip has not accounted for a large market, but there are a lot of its structure, there are ceramic substrate, a single package, as well as integrated packaging and CSP. The bracket flip chip is one of the flip chip packaging.

The emergence of stent flip chip, in fact, is associated with the formal chip. Because before the formal use of stent type, but also related to the chain of equipment is also compatible with. Based on this background, there will be today's concept of stent flip. Refers to the flip chip + with cup cavity bracket, and FEMC refers to the "Filp-chip+EMC bracket", is the flip chip and EMC stent combination of packaging products, is a kind of stent package.

Scaffolding and flip now do mainly Ruifeng EMC scaffold, in terms of thermal resistance, junction temperature, voltage, saturation current, heat stable lumens, compared to ordinary SMD, FC, COBFC, CSP ceramics, have a considerable advantage.

The significance of the existence of bracket inversion

From the LED package market capacity, ceramic and COB package LED package components accounted for about 3%, EMC accounted for 20%, PLCC accounted for about 75% of the visible bracket package accounted for most of the LED package, and on the support package import flip chip, this will be a revolution in the traditional package. According to LEDinside data show that from 2002 to 2017 the flip chip compound annual growth rate of 99%, while the application of flip bracket nearly 3 times the growth.

From a technical point of view, there is a big difference between the CSP and the ceramic package and the COB package, and it is not a simple two-dimensional package.

From the point of view of reliability and equipment matching, because of the advantages of flip chip, the saturation current of the bracket inversion is larger, the current is higher, and the product reliability is better. At the same time, it can meet the universality of the patch technology level, while the CSP package has many advantages, but in the patch, the equipment requirements are relatively high. Therefore, in addition to the protection of the stent packaging, the application should be more simple.

From the point of view of solid crystal material, compared with the EMC package, the thermal conductivity of the whole solder paste of the flip chip is higher than that of the insulating adhesive, which is a very good guarantee for the reliability of the whole product.

From the efficiency point of view, although the flip chip light emitting efficiency is not comparable with the dress chip, but the light efficiency is not very high, it has a very good single light transmittance, because of its relatively low voltage. So on the whole, if we don't take too much light effect, the use of flip chip can reduce the cost of integrated light source. Especially in the TV backlight applications, due to the low transmittance of the glass, the requirements of the LED light efficiency is not so high, so basically can be seamless cut.

Encapsulated flip chip FEMC packaging process

LED flip chip packaging process, in simple terms, is through the 3D printing technology, the solder paste printed on the bracket, and then through reflow and potting process to achieve encapsulation.

From the point of view of reliability and equipment matching, because of the advantages of flip chip, the saturation current of the bracket inversion is larger, the current is higher, and the product reliability is better. At the same time, it can meet the universality of the patch technology level, while the CSP package has many advantages, but in the patch, the equipment requirements are relatively high. Therefore, in addition to the protection of the stent packaging, the application should be more simple.

From the point of view of solid crystal material, compared with the EMC package, the thermal conductivity of the whole solder paste of the flip chip is higher than that of the insulating adhesive, which is a very good guarantee for the reliability of the whole product.

From the efficiency point of view, although the flip chip light emitting efficiency is not comparable with the dress chip, but the light efficiency is not very high, it has a very good single light transmittance, because of its relatively low voltage. So on the whole, if we don't take too much light effect, the use of flip chip can reduce the cost of integrated light source. Especially in the TV backlight applications, due to the low transmittance of the glass, the requirements of the LED light efficiency is not so high, so basically can be seamless cut.

Encapsulated flip chip FEMC packaging process

LED flip chip packaging process, in simple terms, is through the 3D printing technology, the solder paste printed on the bracket, and then through reflow and potting process to achieve encapsulation.

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