TSMC 7 billion 500 million U.S. dollars to build a 12 inch chip factory monthly production of 100 thousand

China's Taiwan foundry business, TSMC has filed an application to build a next generation 12 inch wafer factory in taichung.

According to EE Times reported that the Taichung science and Technology Park and TSMC spokesman said that the final production capacity of the plant plans to process 100 thousand wafers per month. The total investment in the processing plant reached an unprecedented $7 billion 500 million. This investment is roughly equivalent to the current generation of wafer processing plant investment three times.

It is reported that TSMC TSMC will use more advanced 65 nanometer and nanometer technology in the 12 inch wafer etching chip.

TSMC is expected to break ground in 2007 to build the processing plant, is expected to start producing chips in January in August 2008. The initial production capacity is 11 thousand wafers per month. After three stages of expansion, the final production capacity plan is to process 105 thousand wafers per month. The three phase of the expansion of capacity planning will take about five to ten years to complete.

A spokesman for the company confirmed that the company has put forward the application for the construction of the processing plant. However, the spokesman added that TSMC will begin to build a new processing plant in after the twelfth factories in Hsinchu and all of its factories in Tainan are fully operational.