TSMC is expected to increase the level and status of Taiwan LED industry

TSMC to enter the LED industry, the market can not help but ask, with TSMC as high as 45 to 50% of the gross power generation cost control industry, only 20% gross margin of LED and solar energy, why choose to cross the LED industry relatively low margin? In this regard, TSMC chairman Zhang Zhongmou "TSMC will not only make the petty profits cause" the market views contradict. Zhang Zhongmou said, cross foot LED and solar energy, not fashionable, but the existence of high profit opportunities.

TSMC LED lighting technology R & D and production workshop officially started, TSMC officially declared a foot LED industry eating pie. Into the LED industry, focusing on a new generation of solid-state lighting, energy saving and carbon reduction requirements, to replace the traditional lighting. Experts pointed out that in the future when the advent of the era of LED lighting, the demand for LED will be 50 times the current capacity of LED, is a mobile phone applications of the 150 times. However, in line with the current LED lighting standard product yield is only three ~ 40%. TSMC to join, is expected to improve the level and status of Taiwan LED industry.

TSMC long-term focus on silicon in the LED field, the layout of the industry will also be on the basis of. TSMC preliminary planning will be cut from the LED after the paragraph, from the light source processing, power driven to heat dissipation module, all integrated on the silicon wafer. TSMC said that the silicon wafer substrate has a relative advantage in the standardization of mass production, and the cooling efficiency is 3 times of the ceramic substrate, in addition, high accuracy and high reliability.

In addition, TSMC is different from traditional module and encapsulation, in semiconductor process, need not, linewidth control accuracy, can carry out standardized mass production, the cost of natural decline, coupled with longer life, improve the luminous efficiency, the future cost even more than the existing source of cheap, LED lighting the competitive nature will be unlimited expansion. TSMC to patent the semiconductor process and MEMS precision packaging technology as the foundation, using silicon wafer as substrate for package, let the light, electricity, heat treatment device integration as a whole, in addition to smaller volume smaller, lighter weight, stress, heat dissipation efficiency faster, therefore improve the luminescence efficiency.