The breakthrough of large scale integrated circuit packaging materials in China

January 31, 2005, China Institute of chemistry successfully developed can be used for large scale integrated circuit (VLSI) special resin BTPA-1000 and standard advanced packaging materials - BTDA-1000 type photosensitive polyimide, and has applied for 7 national invention patents. At present, the domestic semiconductor companies and research institutes will be ready for this new type of resin manufacturing chip and optoelectronic devices, with an annual output of pilot plant is under construction dozens of tons of industry, is expected to put into operation in July this year. Director, 100080 High Technology Materials Laboratory of the research project researcher Yang Shiyong introduced, with the development of IC chip to the high integration and miniaturization, chip wiring large and thin direction, the requirements of the packaging materials is more and more high. Advanced packaging technologies need to interconnect, power, cooling and device passivation protection technology into a whole, to ensure that the IC circuit exhibits the best performance and reliability. In the national "863" project support, with the leadership of the researcher Yang Shiyong research group after painstaking research, has successfully developed a small volume shrinkage, low curing temperature, special resin photosensitive resin storage type BTPA-1000 and type BTDA-1000 standard polyimide with good stability. The BTPA-1000 type photosensitive polyimide resin with special light crosslinking mechanism, without adding other additives can get fine photosensitive lithography graphics drawing process is simple and can avoid the pollution of foreign impurities on the surface of IC chip to the maximum extent, suitable for multilayer wiring manufacturing technology of multilayer metal interconnection structure or chip passivation, is a kind of negative it has a broad application prospect of photoresist. The research group successfully developed the FC-BGA/CSP encapsulation of UFEP-1000 liquid epoxy resin, which has the characteristics of low viscosity, good fluidity and so on. Because of the latent epoxy resin curing accelerator, it has good storage properties and application time at low temperature and room temperature. The cured resin cured by proper heat treatment process has excellent thermal and electrical insulation properties and good mechanical properties. Polyimide resin is mainly used in IC chip surface passivation, high density packaging device stress buffer internal coating, multilayer metal interconnection structure and MCM interlayer dielectric insulation material. According to the Chinese Epoxy Resin Industry Association of experts at the end of filling liquid epoxy resin is mainly used for circuit flip chip package, reducing chip and organic substrate due to thermal expansion coefficient mismatch stress caused by the protective device against moisture and ionic contaminants, radiation and mechanical vibration, increase the reliability of the device package. These two kinds of materials are the key supporting materials in advanced microelectronic packaging technology, which are widely used in various aspects of high precision electronic packaging and semiconductor manufacturing.