The fourth phase semiconductor packaging production project is launched, with a total investment of 5 billion

A few days ago, the company (hereinafter referred to as "the company") issued a bulletin, the company and the Jinggangshan economic and Technological Development Zone Management Committee after friendly consultation, signed the "fourth phase of the cooperation framework agreement of the wood forest high tech Industrial Park".

Today, he announced that the twenty-fifth meeting of the third session of the board of directors, held in June 4, 2018, passed the bill on the signing of the fourth phase of the cooperation agreement between the "fourth phase project of the Mu Lin high tech Industrial Park", and agreed that the company and the Jinggangshan economic and Technological Development Zone Management Committee of Ji'an, Jiangxi Province, signed "Mun Lin Sen Gao" The fourth phase of the project contract of the science and Technology Industrial Park plans to plan the total amount of no more than 5 billion yuan in the construction of semiconductor packaging and production projects in the Jinggangshan economic and Technological Development Zone, and bring the agreement to the shareholders' meeting for consideration and approval.

According to the announcement, the two sides signed a cooperation agreement in the Jinggangshan economic and Technological Development Zone in Ji'an, Jiangxi Province in June 4, 2018. In Jinggangshan economic and Technological Development Zone Investment and construction projects, the current one or two, three phase of the project has basically reached the schedule; now start fourth phase semiconductor packaging production project: the project is mainly engaged in semiconductor packaging, research and development, production, sales; project investment investment of total investment of 5 billion yuan (including equipment, land, Factory investment).

It is reported that in March last year, the company signed a cooperation framework agreement with the Jinggangshan Jing Kai District on the cooperation framework for the production project of the copperplate. The total investment of the project is 3 billion yuan (including equipment, land and factory investment), mainly engaged in the research and development, production and sales of the PCB copper clad plate.

Mr. Lin said that the LED industry in China is growing at a high speed. A relatively complete R & D and industrial system has been formed, and the overall scale of the industry continues to grow. In order to seize the opportunity for development, the company has signed a cooperation agreement with the Jinggangshan economic and Technological Development Zone Management Committee, which can realize the diversification and complementation of the company's products, extend the industrial chain and increase the profit and profit of the company. This cooperation is in line with the company's industrial layout and development strategy, which can further improve the company's sustainable competitiveness and play a significant role in promoting the long-term and stable development of the company.

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