05 years of multi chip packaging market growth of 32% communication applications

Market research company The Information Network pointed out that the cellular phone, Bluetooth and digital cameras and other applications are driving high density package (HDP) market development, the market growth is expected in 2005 32%, shipments reached 1 billion 500 million.

HDP market includes a multi chip module, multi chip package and packaging system. Such packaging market is expected to grow by 21% in 2006, shipments reached 1 billion 800 million.

2003 high density packaging market in communications applications, consumer applications accounted for 82.9%, accounted for 11% of the second