2007 China's memory market is expected to exceed 100 billion yuan

The development trend of China's market nine memory

China semiconductor memory market trends in the following areas:

Multi chip packaging products into the mainstream market

Multi chip package (MCP) technology can be FLASH, DRAM and other different specifications of the chip package using the system into a single chip, short production time, low manufacturing cost, and high data rate, low power consumption and other advantages, is the main specifications of portable electronic products with built-in memory products. In addition, digital TV, set-top boxes, network communications products have also begun to use all kinds of MCP products.

In 2004, MCP's global demand grew from 230 million in 2003 to $340 million, an increase of $47.8%. Global demand is expected to reach 420 million in 2005. Including Samsung, Hynix, Intel and other heavyweight IC vendors have been optimistic about this market prospects, competing to launch related products. At present, about 90% of the Renesas's embedded memory shipments are MCP, Spansion's wireless market, the stock of memory is also MCP, while the proportion of only two years ago, only 30%.

SRAM development challenges

In view of the market for different applications, the development of SRAM technology products have showed two trends: one is the high speed devices required for the development of high performance communication network; another is to reduce the power consumption, portable applications to adapt to the rapid development of the market.

2004, mobile phones and other mobile terminal market demand for SRAM accounted for about 50% of total demand, and another about 30% of SRAM products were digested by the communications market.

Future SRAM market growth will be smooth and gradual. On the one hand, this feature is related to the development of the service market, the more important thing is that the traditional SRAM technology is being impacted by other competitive DRAM technology. For example, in the high-speed network, the rapid growth of FCRAM and RLDRAM technology are in competition; in portable applications, such as CellularRAM Mobile and FCRAM PSRAM are also gradually squeeze low power application space originally exclusive to the SRAM.

DDR2 into the mainstream of time

In the second quarter of 2004, the Intel Information Technology Summit (IDF), many DRAM vendors have launched a sample of DDR2 products, however, the market mainstream DDR2 also need time. At present, the price of DDR2 products is still high. The main factors of DDR2 high price of the product has the following aspects: first, because of the increase of DDR2 the size of the device, each wafer produced fewer devices; secondly, using the DDR2 test cost higher BGA package and faster, it also increases the cost of. Usually, the product in the first 6 quarters of the market will have a high price phenomenon, with the development of technology and production increases, the price of DDR2 products will continue to decline. In short, DDR and DDR2 products are bound to coexist in the market for a long time.

Mobile phone technology development impetus

Mobile phones are replacing PC as a technology driver for high-density semiconductor memory, and are likely to dominate the market in the next few years. With the market moving from simple voice terminals to feature phones, smart phones and mobile media gateways, this small device already has an operating system and file system.

In order to meet the market demand, the competition has been launched in four kinds of products: currently used to save the non-volatile DRAM memory data, used for code storage NOR FLASH, trying to improve the speed to go beyond the additional card application NAND FLASH, and the micro hard disk has appeared in some functions on the phone.

At the 2004 Electronica exhibition, Samsung released a 90 nm process using 1Gb OneNAND. This NAND flash memory with a NOR interface with up to 5Kb internal cache RAM, which can provide a constant reading rate of 100 Mbps, which is faster than the existing NAND FLASH times. M-Systems provides a solid state disk emulation hardware based on NAND. The product can be written directly to the media system, rather than its DRAM in the cache, you can reduce the number of DRAM in the system. Spansion said it would develop its NOR MirrorBit FLASH into products with the same density and price levels as ordinary NAND FLASH, while providing faster speeds and higher reliability.

Digital TV market will become the second driving force

In the consumer electronics market, due to the relatively high density of digital TV DRAM, once a large number of digital TV shipments, it will likely become an important factor affecting the DRAM market.

The memory of a digital television is basically related to its resolution and the size of the display screen. Due to the large amount of data processing and operation of image processing, the use of digital TV memory density of about 2Mb to 16Mb this range. In general, the higher the resolution, the larger the screen area, the higher the memory density required. In some high-end digital TV, DDR DRAM has also been adopted.

Mobile phone memory capacity

Most of the memory in the phone using LP SRAM, because SRAM than DRAM power. But with the future of mobile phones, PDA and other products increasingly blurred boundaries, more and more features on the phone, which will make the phone's memory capacity gradually rising demand. In terms of capacity constraints LP SRAM will gradually be eliminated. 1T SRAM and LP DRAM in terms of capacity is higher than LP SRAM, and 1T SRAM consumes less power, so the advantage of using the 1T SRAM on the phone is relatively high. In addition, manufacturers in order to save space, but also will be LP SRAM and NOR FLASH in the form of multi chip packaging into a stacked memory chip. not