2007 China semiconductor lighting industry data

2007, the development of China's semiconductor lighting industry for the better, the rapid development of epitaxial chip companies, packaging companies continue to maintain rapid growth in scale, lighting applications have made greater progress. In the rapid growth of the industrial scale at the same time, the domestic industrial structure has been greatly improved, gradually increase the share of high-end products, such as display chip, SMD and large package of products, lamps and other lighting products have obvious progress.

As of December 2007, China's total MOCVD more than and 80 units, of which the production of GaN MOCVD more than and 50, the production of series of about 10 yuan MOCVD, the other research equipment for the domestic research institutes. According to the domestic manufacturers investment plan, in 2008 is expected to add more than 40 MOCVD units, the size of our foreign extension chip production will have a very big upgrade.

2007 China's chip output reached 1 billion 500 million yuan, an increase of more than $1 billion 50 million in 2006, of which the domestic GaN chip output value of 800 million yuan, an increase of $450 million compared with $78% in 2006. 2007 domestic GaN chip production capacity is also very prominent, an increase of 60% compared to 2006, reaching 960kk/ months, the actual annual output reached only 9 billion, the domestic rate also increased to 35%. The most important thing is that the performance of the domestic chip faster, has been in the display, signal lights, outdoor lighting, small and medium size backlight and other high-end applications to be recognized, the market structure has been more obvious improvement. Expected in the next few years, the average growth rate of domestic chip production will be more than 30%.

In 2007 China's LED packaging value reached 16 billion 800 million yuan, up 15% compared to 14 billion 800 million yuan in 2006; the yield from 66 billion in 2006 increased by only 24%, reached 82 billion, which highlighted LED value reached 12 billion yuan, accounting for 71% of total sales LED. At the same time, from the perspective of product and enterprise structure, there are also a lot of improvement in domestic, SMD and high-power LED package is growing rapidly, the current national power packaging capacity has reached about 10KK/ months.

2007 domestic LED production, chip production and chip rate

type

LED output (100 million)

Chip output (100 million)

Chip rate (%)

Four yuan LED

Three hundred

One hundred and twenty

Forty

GaN LED

Two hundred and sixty

Ninety

Thirty-five

General bright LED

Two hundred and sixty

One hundred and seventy

Sixty-four

Total

Eight hundred and twenty

Three hundred and eighty

Forty-six

(data source: CSA/china-led.net)

Market size and growth rate of LED packaging in China (data source: CSA/china-led.net)

Variation of LED packaging output in China (source: CSA/china-led.net)

In 2007 our products output has more than 30 billion yuan, has become a full-color LED display, solar LED landscape lighting application products the world's largest producer and exporter of semiconductor lighting industry is emerging. China has formed a certain characteristics in the field of lighting, the outdoor lighting is the fastest, there are hundreds of enterprises and the construction of LED Street dozens of demonstration Road, but in the domestic large size LCD backlight and automotive headlamp is still backward.

At present, the domestic research level is low power chip 90lm/W, power chip 70 lm/W, power chip industrial level reached 60lm/W, closer to the level of international industrialization. In the preparation of substrate, epitaxial growth, chip technology and so on to master a number of independent intellectual property rights technology. Power type white packaging has made important progress in packaging structure design, heat dissipation, lens, fluorescent powder coating etc., using foreign chip package optical efficiency of up to 70-80lm/W, reached the level of international industry. However, domestic stability, quantity, especially high-quality production technology needs to be further improved.

Comparison of domestic and international technical indicators of power white LED (December 2007)

classification

Luminous efficiency (lm/W) @350mA

Color rendering index

Current domestic industry level

60 to 68

>80

Level of domestic industry at the end of fifteen

30 to 40

>70

Korea, Taiwan, China

60 to 70

>80

America, Japan and Europe

70 to 80

>80

(data source: CSA/china-led.net)

It is worth noting that the international semiconductor lighting core patent disputes began to directly affect domestic enterprises. The American research institutions recently through the application of "337 investigation", to create trade barriers by patent, has been directly involved in 6 China enterprises, the domestic enterprises in the international patent dispute situation has changed, the domestic enterprises should adjust the patent strategy as soon as possible.

2007 is also a rapid increase in the domestic semiconductor lighting industry investment in the year, from the upstream epitaxial chip, downstream packaging applications to the relevant materials and auxiliary industry investment has increased significantly. According to incomplete statistics, in 2007 the domestic semiconductor lighting industry related new investment of nearly 4 billion yuan, while the planned investment is more than 15 billion. At the same time, the financing channels of enterprises have shown a trend of diversification, the introduction of strategic investment, venture capital, overseas listing, backdoor listing, mergers and acquisitions and other capital operation will bring new changes in China's industrial structure.

Source: National Semiconductor Lighting Engineering Research and development and Industry Alliance