2008 China semiconductor lighting industry data

The first half of 2008, China's semiconductor lighting industry has maintained the momentum of development and growth of good, especially the epitaxial chip production capacity of the enterprise has been greatly improved, the automation level of packaging enterprises to improve lighting applications in road lighting, mainly achieved some development. At the same time, the rapid growth of the industrial scale, the domestic industrial structure has also been greatly improved, the scale of the industry leading enterprises continue to expand, industrial concentration has increased.

But from the beginning of the second half of 2008, the semiconductor lighting industry began to be affected by the financial crisis to varying degrees. From the beginning of the second half, corporate sales decreased significantly. According to preliminary statistics, most of the semiconductor lighting enterprises in the 4 quarter of 2008 monthly sales decreased by about 30% compared with the first half of the year, has been part of low-end products, smaller companies suffered the greatest impact, monthly sales fell more than 50%.

Throughout the year, the development of China's semiconductor lighting still maintain growth, but its development and the beginning of the year is expected to have a certain difference.

In 2008, I have a rapid increase in foreign chip equipment, chip production growth. According to statistics, the domestic MOCVD has more than 100 units, including the production of GaN MOCVD has been installed more than 85 units, the production of the MOCVD series of about 15 yuan, the domestic research institutes research equipment has increased. Although affected by the financial crisis, epitaxial chip investment plan will be adjusted, but it is expected that in 2009 China's MOCVD will not be less than 30 units, epitaxial chip production capacity will continue to maintain rapid growth.

2008 China chip output growth of 26% to reach $1 billion 900 million, compared with the growth rate of 43% in 2007 has been reduced, the domestic GaN chip output value of $1 billion 100 million, an increase of 37%, also lower than in 2007 of 78%. 2008 domestic GaN chip production capacity is very prominent, compared with an increase of 45% in 2007, reaching 1400kk/ months, while the actual annual production increased by 34%, reaching only 13 billion, the domestic rate also increased to 41%. Domestic chip performance has been greatly improved, in the display, signal lights, outdoor lighting, small and medium size backlight and other high-end applications to be recognized. In 2008, the financial crisis and Taiwan enterprises bidding chip, domestic chip companies in the first half of 2009 will be subject to greater pressure on the operation, but the next few years, the average growth rate of the domestic chip production capacity will remain above 30%.

In 2008 China's LED packaging value reached 18 billion 500 million yuan, up 10% compared to 16 billion 800 million yuan in 2007; the yield from 82 billion in 2007 increased by only 15%, reached 94 billion, which highlighted LED value reached 14 billion yuan, accounting for 76% of total sales LED. At the same time, from the perspective of product and enterprise structure also has a greater improvement in the domestic, SMD and high-power LED packaging growth.

In 2008, the output value of our products has been more than 45 billion yuan, LED full-color display, solar LED, landscape lighting, consumer electronics backlight, signals, instructions and other applications are still the main areas of application. 2008, the rapid development of domestic outdoor lighting, there are already about one hundred thousand LED demonstration application of street lamps are applied, is expected to soon form an industrial scale. The city's public area lighting has also begun to demonstrate the application of LCD-TV backlight and automotive light has also made some progress, but the formation of the industrial scale will take some time.

In 2008, China was the two time the United States, "the 337 survey", involving domestic enterprises, covering the industrial chip, packaging, the application of the industrial chain, the patent problem has a direct impact on the development of the domestic industry. According to the survey, how to deal with the patent problem has become a problem that must be solved in the further development of the enterprises with large scale and foreign market.