2009, China's chip output growth of 25% compared to 2008, reaching $2 billion 300 million; LED packaging output value of 20 billion 400 million yuan; semiconductor lighting applications in the financial crisis, the impact of contrarian growth of more than 30%, reaching $60 billion. 2009 China's total LED industry totaled 82 billion 700 million yuan!
2009 is a year in which the internal and external environment of China's semiconductor lighting industry has changed. From the industrial environment, the domestic and foreign influence events in the industrial environment, semiconductor lighting are closely linked with the world economic and social development increasingly, opportunities and challenges coexist; from the industry itself, constant breakthroughs in technology at home and abroad, a new application of the rapid development of relevant policies to support the gradual introduction of competition in the industry, technology and market the product, and other aspects are the emergence of new forms; from the industry development trend, opportunities for the development of China's semiconductor lighting industry significantly outweigh the challenges, the overall industry environment and industry competition to further improve the industry development prospects are brighter.
2009 is also a big year for China's semiconductor lighting industry. In the first quarter, the financial crisis in 2008 led to the continued decline in exports, the slow development of the industry, some enterprises operating difficulties or even bankruptcy. From the beginning of the second quarter, with China's "ten city lights" demonstration project to promote the domestic and international market situation improved, semiconductor lighting industry has begun to rise, become one of the first to get rid of the financial crisis affecting the industry. In the second half, China's semiconductor lighting industry continues to improve, driven by the concept of energy conservation and emission reduction and low carbon economy, semiconductor lighting has become a hot industry.
2009, affected by the rapid increase in chip demand, foreign chip production capacity increased rapidly. According to statistics, in the domestic LED chip production enterprises with more than 40 enterprises, MOCVD has more than 150 sets, of which the production GaN MOCVD has installed more than 135 units, the production of four yuan MOCVD around 18 Taiwan, domestic research institutes and research equipment also increased. The extension of the chip chip companies to further accelerate the pace of investment, according to preliminary statistics, the planned equipment in 100 or so, its development is expected to exceed the early 2009.
2009, China's chip output growth of 25% to reach $2 billion 300 million, with a growth rate of nearly 26% in 2008. 2009 domestic GaN chip production capacity is very prominent, compared with an increase of 60% in 2008, reaching only 2 billion 240 million / month, while the actual annual output increased by 40%, reaching only 18 billion 200 million, the domestic rate also increased to 46%. The performance of the domestic chip has been greatly improved, in the display, signal lights, outdoor lighting, small and medium size backlight and other high-end applications to be recognized, the performance and output of high-power chips have been greatly improved. In 2009, with the rapid improvement of the impact of the financial crisis gradually weakened and the business situation, domestic chip enterprises to obtain a better business environment in 2009, is expected in the next few years, domestic chip production capacity and business conditions will continue at a rapid ascension process.
In 2009, China's LED packaging value reached 20 billion 400 million yuan, up 10% compared to 18 billion 500 million yuan in 2008; the yield from 94 billion in 2008 increased by only 10%, reached 105 billion 600 million, which highlighted LED value reached 18 billion 600 million yuan, accounting for 90% of total sales LED. At the same time, from the perspective of product and enterprise structure also has a greater improvement in the domestic, SMD and high-power LED packaging growth.
2009, China's semiconductor lighting applications in the wake of the financial crisis has made rapid growth, the overall growth of more than 30%, the output value reached 60 billion yuan. LED full-color display, solar LED, landscape lighting, consumer electronics backlight, signals, instructions, as the main application areas, the growth is relatively stable. In the context of LED-TV accelerated applications, China's LED large-size backlight applications have made important progress, the major TV brands have launched LED backlight TV, and as the focus of the next few years to develop and promote products. In our country, "Ten City million" demonstration project driven by the application, LED street lighting and other road lighting, LED lighting and other indoor lighting applications developed rapidly. LCD backlight and lighting growth in 2009 is obvious, is gradually becoming the main application of semiconductor lighting in china. 2009 semiconductor lighting applications as shown in the following table.
In terms of investment, domestic large enterprises, large capital began to intervene in the semiconductor lighting industry, industrial investment has increased significantly. According to public information statistics, in 2009 the country LED project total investment (including investment plan) has more than 20 billion yuan, the number of listed companies through acquisitions or raise capital investment into the semiconductor lighting field, there are a number of semiconductor lighting enterprises actively preparing for listing to raise funds to expand the scale.
In terms of technology, the domestic production of low-power chips has reached 120lm/W, power chip 80 -100lm/W, and the international industrial level closer. China's independent intellectual property rights of the Si substrate chip light efficiency reached 70lm/W, and achieve large-scale production. China's high power packaging level and the international first-class level of basic synchronization, in small, multi batch production capacity in the international advanced level, such as miner's lamp, landscape lights and other special needs of LED packaging products.
It is expected that in 2010, there will be some new changes in the promotion of applications, technical level, capital operation or business management.
In the application, the growth will be mainly reflected in the lighting and LCD backlight applications, the development of other areas will be more stable. With the rapid decline in the price of semiconductor lighting products and the maturity of application technology
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