Agilent dizino first TD-SCDMA RFIC laboratory cooperation

Dizino communications (Comlent) and Agilent Technologies (Agilent Technologies) today announced that the two companies to establish cooperation in the Asia Pacific region's first "TD-SCDMA RFIC demonstration laboratory officially settled in Shanghai Pudong, which is so far the only region of a TD-SCDMA RF integrated circuit special laboratory.

According to reports, the establishment of the laboratory, aims to research and development, 3G mobile communication based on TD-SCDMA standard Chinese RF integrated circuit and LED module and mobile communication terminal products testing and certification to provide strong technical support. Different from each leading WCDMA and CDMA2000 two 3G standards in Europe and the United States, the TD-SCDMA standard currently brewing breakthrough new hope for the global 3G industry benchmark, is getting more and more attention and support China official and industry. As the first China has substantial research results to promote the industrialization of the RF technology leading enterprises, Comlent communications with Agilent Technologies handshake, will actively promote the China 3G mobile communication industry, especially in the field of TD-SCDMA RF technology has always been a short board, won the stage leap forward promotion.

In this new laboratory platform, the core communications will select the Agilent technology RF and mixed signal design software (RFDE), as a new benchmark for its RF mobile communications technology research and development. In the future, a series of technology and R & D cooperation will promote China's TD-SCDMA industry chain in the core technology to accelerate the growth and maturity. As the world's largest mobile terminal market, China currently has 400 million mobile subscribers, and this figure is still growing at an annual rate of two digit percentage. China's potential TD-SCDMA industry will trigger a breakthrough from the RF chip design to the entire chain of mobile communication terminals.

Over the past few years, the core has invested $10 million for research and development, due to the mass production of radio frequency and power amplifier to achieve industrialization. This is a new milestone in China's RF technology. At the same time, Ding core in China has established a very competitive team, for the further development of the future lay a solid foundation." Comlent semiconductor company president and CEO Chen Kai said, "dizino will continue to increase investment, is committed to such as the TD-SCDMA standard 3G mobile communication Chinese independent innovation and market to provide advanced RF and mixed signal technology, local strong technical support and excellent quality of service. We will also play a win-win industry alliance and the power of partnerships."

Agilent technology EEsof EDA Department of Asia Regional Manager Ye Haoxiang said: with China's 3G market began to grow, we are fortunate to be able to communicate with well-known enterprises core communications, and jointly create a core competitive advantage. Dizino is China communication IC industry leading R & D and one of the driving forces; and our solutions, EDA RF integrated circuit design software and related consulting services, all contribute to the mobile and wireless communications product design, shorten the cycle and optimize efficiency, plays an important role in the whole development process of RF integrated circuit in".

Ltd. was founded in 2002 in Zhangjiang hi tech park, Shanghai, China, said it was the first non chip factory (fabless) RF IC chip design companies. The company's main product line covers the core RF and mixed signal IC chips for wireless communication, RF and mixed signal chip, mobile communication terminal and portable multimedia player.