Dainippon screen launched zero emission of VOC 300mm epitaxial wafer cleaning device

Dainippon screen developed without the use of solvent and cleaning 300mm epitaxial wafer device using the dry air drying module. Prior to the epitaxial film drying process is the use of IPA (isopropyl alcohol, (CH3) 2CHOH), and the use of the cleaning of the epitaxial film blowing dry air after the new technology. IPA is a kind of VOC (volatile organic compounds) which is prohibited by air pollution law. Because the IPA is not used, the environmental pollution can be reduced.

The dew point of the dry air used in the new module is very low, even if it does not condense to -70 DEG C, so the water after cleaning can be removed in a short time. Processing time compared with the use of IPA, only about 1 / 2.

Due to the use of IPA, but also can significantly reduce the cost of use. In the use of the original module, each device to use about 16 thousand and 206 liters per year IPA. The annual cost can be cut about 9 million yen, according to Dainippon screen projection, the annual cost can be reduced by up to the original 1 / 8.

Original drying method (left) and newly developed drying method (right)

The module has begun to be embedded in the company's 2005 listing of batch cleaning device "FC-3100" in the sale, the price of the module monomer is not released. The device with the new module is "much higher than the original unit" (the PR office). The price of FC-3100 is 300 million to 400 million yen (varies by specification). The original module and the use of new models are in this price range. The new FC-3100 will start selling in December 2008.

Source: Nikkei BP