Design of LED light source for plastic mold silicone

Introduction: in the LED product design, including two optical devices, light guides, light guides and other optical devices, can be molded silicone is emerging as a viable option. The new formulation specifically designed for semiconductor solid-state lighting can withstand the high temperature generated by the LED semiconductor junction and does not result in optical performance degradation. The material can also be used to mold the complex shape, providing greater flexibility in product design.

With more and more LED instead of traditional light sources, the global lighting market is on the eve of a comprehensive change. According to analysts, LED lighting market will grow at an average annual growth rate of 30%, by 2020 will be more than $81 billion in size, close to 60% of the overall market share of lighting. LED is the field of general lighting more and more accelerated by support and confirms the prediction, from the lamp of low power consumption, low flux, such as lamp replacement products (LED is widely used in replace of low power and compact fluorescent lamp and halogen lamp); to more challenging applications, such as lighting, industrial lighting, office lighting, high-power halogen lamps or stadium lighting etc.. When the LED light source to penetrate further into the application needs more high lumen density and power, in terms of physics will require its work under the higher temperature, although designers seek to reduce the number of LED or LED, will be more closely aligned, light body to develop the product with the previous generation devices or equivalent smaller. At the same time, LED designers are also constantly on the module, light source and light innovation, so that the use of fewer devices to integrate more features, or the introduction of smaller and more complex features. LED manufacturers are looking for new materials to speed up growth, improve yield (especially larger components), or reduce waste.

new material

For such a new field of lighting, the use of the design and use of materials are in the rapid update, all of the above mentioned challenges are actually have to face the growing pains". In response, the industry continues to explore the use of new materials, such as silica gel, it is seldom used in LED, but in advanced electronic devices such as silica gel, automotive and communication and many other areas have been used for a long time, and prove its reliable performance. Silica gel can solve some of the challenges of the next generation of LED design, including high temperature, improve lumen density, enhance manufacturability and achieve more complex design, etc.. And LED- like, silicone is also in progress.

Recently, a number of leading optical devices and LED manufacturers have been in their new design using a new class of optical grade molded silicone, and obtained a positive result. Some grades of silica gel are transparent and can be molded silicone. In addition, the same as traditional silica gel materials, viscous silicone molding before curing is low, compared with the organic polymer or glass, silica gel can easily be shaped into complex shapes, two lens, light pipe, light and other optical devices provide more design options. This feature can also help manufacturers reduce costs, shorten the cycle time of injection molding and other processes, and reduce the cost of LED lighting and lighting systems. Finally, compared with many organic materials, the chemical properties of silica gel can be a good solution to the current and future LED lighting system temperature rising problem.

Higher temperature LED design

Molded silicone is particularly good at producing a lot of heat. As a kind of high performance material, it can easily withstand the temperature of 150 DEG C or even higher, and will not significantly reduce its light and mechanical properties. With LED light from a smaller package size in a higher density of white light, and light and light customers want smaller, higher brightness, the temperature of the device will be significantly increased, then the properties of silica gel will become more attractive. With the continuous improvement of lumen density, the current high brightness LED package temperature has been as high as 1500C. This is not only a challenge to the traditional epoxy sealing materials used in LED encapsulation, but also exposes the traditional two stage optical devices such as polycarbonate and acrylic (acrylic) to higher temperature. Generally speaking, these plastic materials will decrease gradually when the temperature is higher than 125 DEG C and 950C temperature. This is also true when the epoxy resin is above 1500C.