Elec-Tech: new opportunities and new challenges brought by CSP and FcoX

"Recently visited Guangya Exhibition, I feel very excited, see the fruit is growing, a lot of flip chip applications on the stage. "

It is sponsored by LEDinside, LED and Chinese Guangzhou International Lighting Exhibition in June 11th LEDforum2016 LED China international market trends Forum, Elec-Tech chip division vice president Mo Qingwei, entitled "Flip Chip on X (FCoX) - the new architecture, new opportunities and new challenges" in the opening words.

Elec-Tech chip division vice president Mo Qingwei's speech at the LEDforum2016 LED Chinese international market trends Forum

Upside down strong growth, the industry is obvious. Mo Qingwei said, according to the BDO flip chip turnover shows that from the beginning of 2013, there are dozens of times the growth in recent years, the past two or three years has maintained a growth of three times, and look forward to 2016 is three times in 2015, and this growth continues, because still discover new markets and new applications. The strong growth of the market, which in the LED technology above what happened?

Flip chip showed three major changes in the packaging architecture showed the top two changes

The first change: in the early stages of the metal reflector has been used as electrodes and reflective surface, and in the past year, the technology of DBR to do the reflection layer is gradually rising. The DBR technology has been widely used, mainly due to the production equipment and the equipment is exactly the same chip, which will be a good change. Of course, DRB also has its shortcomings, that is, heat issues.

Because DBR is an insulating material, its heat dissipation, large current capacity with some metal diffusion gap compared, which also determines the DBR will focus on the small size and low power LED in the next few years, while the power of large size will remain the metal electrode technology, this is a trend.

The second change is the continuous development of high voltage flip chip has been accepted by the market, more and more customers like high voltage flip chip products, because they can be used directly to form the bulb module.

The third is not so much a change as an effort. Flip chip has been focused on the blue chip and some green chips, and the future is expected to do is a full spectrum of flip chip, which needs to overcome the yellow light, red chip flip chip.

If successful, the future full spectrum lighting scheme can get a full spectrum module with a very standard package form, which is the Ministry of science and technology in 2016 Elec-Tech with a special focus on the special focus on LED is a full spectrum of solutions, it will need a key to us conquer.

The flip chip these three major changes, but also to the entire package and module architecture has brought changes, mainly reflected in these two areas.

The first architecture changes, called FcoX (FlipChiponX). Due to the early standard package package, you can remove the crystal line, directly on the bracket inside, and even can be placed on the PCB bracket on board, and now can be achieved. In this Guangya Exhibition can be seen on many related products, like FEMC, PCT2835 etc. Hongli ruifeng. Another framework is CSP.

FcoX what terminal changes?

In commercial lighting, visit this sub exhibition light, saw a lot of COB companies, we are talking about narrowing out the smooth, improve the optical density, which shows that commercial lighting on the increasingly high quality requirements of light. Not only need a very clear spot, with two optical very well, but also need a good reliability.

But insiders know that, in fact, these two are contradictory. Because the temperature is very high, will bring two failure mode. First, the fracture of the crystal line, one is the rupture of silica gel. So in the high-end business photos, especially in the future direction of the development of high power density, flip will be very competitive.

In the lamp, you can not do 2835 lights, but directly to the chip on the substrate, so there are two advantages of fluorescent lamp. First, there is no support, there is no gold wire, you can save costs, but also a board to go in, the whole tube out, improve production efficiency. The two is a tube with 80 to 2835 light emitting angle is 120 degrees, which determines the width of your design, and the emitting angle affixed directly to 140-150 degrees, so that the results can be achieved by the number of relatively small, can get the fluorescent lamp without shadow.

In the filament lamp, although the benefits of flip chip is limited, but there is still a little advantage, that is, high reliability and flexibility. Since the flip chip does not have a crystal line, so it can bend to bend, flexibility is relatively high, this will have a certain impact on the market, which is flip chip in the filament lamp a more interesting application.

CSP what terminal changes?

In the application of mobile phone flash to Meizu Pro6 project, so a small flash space to put into the 10 LED, and is a double color temperature, the general technology is difficult to do, and can be achieved with CSP. The high light density, small size advantage will be applied in many different places.

In the application of the spotlight, put the CSP into a spotlight inside, optical constant, directly to 15 degrees, or even less than 15 degrees, which is very popular in the market. Because the spot is very beautiful, it is also necessary to explore its origin, or because the size of the package with the same size of the chip, optical density is actually very high.

It will