Green Lighting China2011 semiconductor lighting package products and technology exchange activities

Today's LED chip luminous efficiency is sufficient to compete with a variety of traditional light sources, in terms of service life is far better than other technologies. However, in the latter part of the package, the module, the process of lighting, if you can not properly handle the heat, power supply, two optical and other issues, LED performance is still difficult to win market recognition. LED package in addition to the protection of the internal LED chip, but also has the LED chip and external electrical connections, heat dissipation and other functions, and therefore has a key position.

In order to make the LED chip to produce light can high efficient transmission to the outside, can be generated by efficient transmission out, LED package must have high strength and high insulating properties, high thermal conductivity and high reflection etc..

At present, LED packaging technology change rapidly, in order to better serve the exhibitors, set up in the industry effectively technology and business exchange platform "Green Lighting China 2011" will be special in the exhibition site opened "semiconductor lighting technology and product exchange package"

In this meeting, industry experts and leading companies in Europe and the United States, Japan and South Korea, Taiwan and the mainland will China, in-depth exchanges including advanced packaging technology, ACLED packaging technology, multi chip package technology, phosphor technology, heat dissipation structure installation technology and other hot topics in the field of advanced technology and LED package.

The activity will also invite the audience fully through various channels, including: packaging industry manufacturers, backlight manufacturers, LED lighting factory, LED waterproof power production plant, manufacturing plant, electronic display equipment distributors, agents and so on.

Compared with other types of activities, this activity will be held in the "Green Lighting China 2011" exhibition site will be more commercial value and practice, not only to participate in the activities of enterprises can obtain the release and communication of enterprise products and technology opportunities, more able to fully understand and grasp the real needs of the end user. Through theoretical explanation and on-site product presentations, a better interpretation of the unique advantages in the field of enterprise.

As an important part of CO sponsored by the national semiconductor lighting industry alliance and the UK R & D and Reed Exhibitions of the "Green Lighting China" - semiconductor lighting package technology and product exchange activities will be more professional, more close to the way, to provide the most effective service for exhibitors.

As one of the organizers: Deputy Secretary General Alliance national semiconductor lighting project chief Ruan Jun said that to further strengthen the coordination between the central and local and overall planning, increase continuous R & D investment, optimize resource integration, accelerate the establishment of subsidies and government procurement policies to support the cultivation of energy management contract and other innovative business promotion mode. Will be the future of semiconductor lighting industry has a strong foundation of greater development, and industry professional exhibitions and activities, is to promote the best platform for science and technology and trade, policy and industry combination. We believe that careful preparation of the Green Lighting China 2011 "will become the industry breakthrough in the development of the best platform and partner.